白子恒,李雪鸣,胡玉婷,王吉瑞,卢琳,董超芳,肖葵.热带雨林环境中霉菌对PCB-Cu腐蚀行为的影响[J].表面技术,2019,48(7):271-277.
BAI Zi-heng,LI Xue-ming,HU Yu-ting,WANG Ji-rui,LU Lin,DONG Chao-fang,XIAO Kui.Effect of Mold on the Corrosion Behavior of PCB-Cu in Tropical Forest Environment[J].Surface Technology,2019,48(7):271-277 |
| 热带雨林环境中霉菌对PCB-Cu腐蚀行为的影响 |
| Effect of Mold on the Corrosion Behavior of PCB-Cu in Tropical Forest Environment |
| 投稿时间：2018-10-31 修订日期：2019-07-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.07.030 |
| 中文关键词: 微生物腐蚀 霉菌 印制电路板 大气腐蚀 铜 电化学行为 |
| 英文关键词:microbiologically influenced corrosion mold printed circuit boards copper electrochemical behavior |
| 基金项目:国家自然科学基金（51671027，51271032）；国家材料环境腐蚀平台（2005DKA10400） |
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| Author | Institution |
| BAI Zi-heng | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| LI Xue-ming | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| HU Yu-ting | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| WANG Ji-rui | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| LU Lin | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| DONG Chao-fang | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| XIAO Kui | Corrosion and Protection Center, Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
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| 中文摘要: |
| 目的 研究PCB-Cu在热带雨林环境下的霉菌腐蚀行为。方法 利用平板培养法筛选出PCB表面出现频率较高的两株真菌Fusarium solani和Daldinia eschscholtzii。利用干重法研究Cu2+对其生理活性的影响，利用扫描电子显电镜观测PCB-Cu表面的生物成膜情况，并利用动电位极化曲线研究其腐蚀电化学行为。 结果 两株真菌在6天时，均能在PCB-Cu表面形成生物膜，且在菌丝密集处，出现腐蚀产物的堆积。同时，薄液膜内Cu2+浓度的升高能抑制菌体的繁殖。相比于无菌组，两株菌株均能够在前期抑制PCB-Cu自腐蚀电位Ecorr的升高，在后期抑制PCB-Cu自腐蚀电位Ecorr的降低。结论 霉菌孢子接种到PCB-Cu表面后，由于初期PCB-Cu表面薄液膜中的Cu2+含量较少，对菌体的抑制作用较低，因此菌体活性较好，其分泌物抑制了PCB-Cu表面氧化膜的生成，从而在初期促进了PCB-Cu的腐蚀。但随着腐蚀反应的进行，PCB-Cu表面薄液膜中Cu2+浓度逐渐升高，菌体的活性受到抑制，因此腐蚀性分泌物含量下降，而此时附着在PCB-Cu表面的生物膜对基体起到了保护作用，从而开始抑制腐蚀。 |
| 英文摘要: |
| The work aims to study the corrosion behavior of mold on PCB-Cu in tropical forest environment. Two fungi strains with the most high occurrence frequency, Fusarium solani and Daldinia eschscholtzii were selected from surfaces of PCBs via PDA culture . The dry weight method was used to study the effect of Cu2+ on biological activity. The biofilms on surface of PCB-Cu were observed by SEM and the polarization curves were adopted to investigate the electrochemical corrosion behavior. After 6 days, both fungi strains could form biofilm on PCB-Cu surface and accumulate corrosive products at mycelium concentration. At the same time, the increase of Cu2+ concentration in thin liquid membrane could inhibit the growth of bacteria. Compared with aseptic group, both strains could inhibit the increase of PCB-Cu self-corrosive potential Ecorr in the early stage and the decrease of PCB-Cu self-corrosive potential Ecorr in the later stage. After inoculation of fungal spores on PCB-Cu surface, the activity of fungi is better because the content of Cu2+ in the thin liquid film on PCB-Cu surface is lower in the initial stage, and the secretion inhibits the formation of oxide film on PCB-Cu surface, thus promoting the corrosion of PCB-Cu in the initial stage. However, with the corrosion reaction proceeding, the concentration of Cu2+ in the thin liquid film on PCB-Cu surface gradually increases, and the viability of fungi is inhibited, so the content of corrosive secretion decreases. At this time, the biofilm adhering to PCB-Cu surface protects the matrix and begins to inhibit corrosion. |
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