董健,窦炳胜,贺飞羽,孙彦辉,黄洪涛,郑剑平.不锈钢表面渗铝层/ZrO2复合涂层残余应力模拟[J].表面技术,2019,48(6):221-228.
DONGJian,DOU Bing-sheng,HE Fei-yu,SUN Yan-hui,HUANG Hong-tao,ZHENG Jian-ping.Residual Stress Simulation of Aluminized Layer/ZrO2 Composite Coating on Stainless Steel[J].Surface Technology,2019,48(6):221-228 |
| 不锈钢表面渗铝层/ZrO2复合涂层残余应力模拟 |
| Residual Stress Simulation of Aluminized Layer/ZrO2 Composite Coating on Stainless Steel |
| 投稿时间：2018-10-12 修订日期：2019-06-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.06.026 |
| 中文关键词: 复合涂层 残余热应力 有限元分析 氧化锆 阻氢涂层 |
| 英文关键词:composite coating residual thermal stress finite element analysis zirconia hydrogen barrier coating |
| 基金项目: |
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| Author | Institution |
| DONGJian | 1. Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China |
| DOU Bing-sheng | 1. Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China |
| HE Fei-yu | 1. Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China |
| SUN Yan-hui | 1. Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China |
| HUANG Hong-tao | 2.China Institute of Atomic Energy, Beijing 102413, China |
| ZHENG Jian-ping | 2.China Institute of Atomic Energy, Beijing 102413, China |
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| 中文摘要: |
| 目的 研究不同制备工艺参数对渗铝层/ZrO2复合涂层残余应力的影响。方法 采用ANSYS 18.1软件中的Workbench模块，采用热力耦合的方法，对沉积过程中不同制备工艺参数下产生的残余应力进行数值模拟。结果 保温时间由2 h增长至5 h，等效应力由895 MPa减小至862 MPa。沉积温度由400 ℃升高至700 ℃，等效应力由541 MPa增加至999 MPa。ZrO2层厚度从2 μm增加至14 μm，等效应力由925 MPa减小至835 MPa，但是渗铝层-氧化锆层界面的剪切应力由59 MPa增加至101 MPa。基体厚度的变化对基体及渗铝层内的热应力影响不大，但对ZrO2层有较大的影响，基体厚度由0.3 mm增加至0.8 mm，等效应力由745 MPa增加至850 MPa。渗铝层使等效应力由877 MPa减小至745 MPa，径向应力由-1235 MPa减小至-1072 MPa，剪切应力由105 MPa降低到89 MPa，轴向应力由-375 MPa减小至-312 MPa，其中ZrO2层中的轴向应力改变明显，由-128 MPa减小至-39 MPa。结论 增加渗铝保温时间，整个复合涂层的应力降低。沉积温度与室温相差越大，热匹配失衡越严重。ZrO2层厚度增加，基体和渗铝层的应力均有升高，ZrO2层内部除剪切应力稍增加外，其余应力均减小。基体厚度增加，ZrO2层等效应力和径向应力均明显增大，因此应降低基体的厚度。渗铝层起到很好的缓冲作用。 |
| 英文摘要: |
| The work aims to study the influence of different preparation parameters on the residual stress of aluminized lay-er/ZrO2 composite coating. Workbench module in ANSYS 18.1 software was used to generate residual stress under different preparation parameters in the deposition process with thermal mechanical coupling. As the holding time increased from 2 h to 5 h, the equivalent stress decreased from 895 MPa to 862 MPa; As the deposition temperature increased from 400 ℃ to 700 ℃, the equivalent stress is increased from 541 MPa to 999 MPa; As the thickness of ZrO2 layer increased from 2 μm to 14 μm, the equivalent stress decreased from 925 MPa to 835 MPa, but the shear stress at the interface of aluminized layer and zirconia layer increased from 59 MPa to 101 MPa. The change of the thickness of the substrate had little effect on the thermal stress in the substrate and the aluminized layer, but had a great influence on the ZrO2 layer. As the thickness of the substrate increased from 0.3 mm to 0.8 mm, the equivalent stress increased from 745 MPa to 850 MPa. The aluminized layer reduced the equivalent stress from 877 MPa to 745 MPa, the radial stress decreased from -1235 MPa to -1022 MPa, the shear stress decreased from 105 MPa to 89 MPa, and the axial stress decreased from -375 MPa to -312 MPa. The axial stress in the ZrO2 layer changed significantly from -128 MPa to -39 MPa. Increasing the aluminizing holding time can reduce the stress of the whole composite coating; The greater the difference between the deposition temperature and the room temperature is, the more serious the thermal matching imbalance is; As the thickness of the ZrO2 layer increases, the stresses of the matrix and the aluminized layer increase, and the stress in the ZrO2 layer decreases slightly except for the shear stress. As the thickness of the substrate increases, the equivalent stress and radial stress of the ZrO2 layer increase significantly, and the thickness of the substrate decrease. The aluminized layer plays a good buffering role. |
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