余斌,孙德恩,Yongda Zhen.PVD导热涂层的研究综述[J].表面技术,2019,48(6):158-166.
YU Bin,SUN De-en,Yongda Zhen.Thermal Conductive Coatings by PVD Technology[J].Surface Technology,2019,48(6):158-166 |
| PVD导热涂层的研究综述 |
| Thermal Conductive Coatings by PVD Technology |
| 投稿时间：2018-11-29 修订日期：2019-06-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.06.018 |
| 中文关键词: 导热涂层 热导率 热阻 声子散射 界面结构 |
| 英文关键词:thermal conductive coatings thermal conductivity thermal resistance phonon scattering interface structure |
| 基金项目:国家自然科学基金（51771037）；材料腐蚀与防护四川省重点实验室开放基金（2016CL13）；重庆市基础与前沿研究计划项目（cstc2015jcyjA70005） |
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| 中文摘要: |
| 首先从导热涂层的应用背景出发，分析了导热涂层研究的必要性，其次探讨了导热涂层的导热机理和影响涂层导热的宏观和微观因素。在此基础上，阐述了PVD导热涂层的研究现状，重点分析了SiC、AlN、DLC三种常见的具有较大应用潜力的PVD导热涂层。声子散射是影响涂层热导率的直接原因，涂层内部同位素、杂质、缺陷及晶界等均会引起声子发生散射，而界面声子散射引起的界面热阻对涂层导热性能影响巨大，通过合理选择制备技术和精确控制工艺参数，在一定程度上能改善涂层的导热性能，提高热导率。在此基础上，笔者提出了离子源辅助高功率脉冲磁控溅射（HiPIMS）的工艺配合，提高涂层质量和致密度，优化界面结构，降低界面热阻，以期实现涂层的高导热性能。 |
| 英文摘要: |
| Firstly, the necessity of thermal conductive coating research was analyzed based on the application background of thermal conductive coating. Secondly, the thermal conduction mechanism of the coating and the macroscopical and microcosmic factors affecting the thermal conductivity of the coating were discussed. On this basis, the research status of PVD thermal con-ductive coatings was described, and three common PVD thermal conductive coatings, namely SiC, AlN and DLC, were em-phatically analyzed. Phonon scattering was the direct factor affecting the thermal conductivity of the coating, and phonon scattering could be caused by some factors, such as coating internal isotope, impurities, defects and grain boundary. The interfacial thermal resistance caused by phonon scattering had great influence on the thermal conductivity of the coating. Thermal conductivity of the coating could be improved to a certain extent by reasonably selecting preparation technology and accurately controlling process parameters. On this basis, the technological cooperation of ion source assisted high-power pulsed magnetron sputtering (HiPIMS) is proposed to improve coating quality and density, optimize interface structure and reduce interface thermal resistance, in order to achieve the high thermal conductivity of the coating. |
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