李雪鸣,胡玉婷,易盼,白子恒,肖葵,董超芳,卢琳,李晓刚,魏丹.热带雨林环境中典型霉菌对PCB-HASL腐蚀行为的影响[J].表面技术,2018,47(9):126-132.
LI Xue-ming,HU Yu-ting,YI Pan,BAI Zi-heng,XIAO Kui,DONG Chao-fang,LU Lin,LI Xiao-gang,WEI Dan.Effect of Typical Molds on PCB-HASL Corrosion Behaviors in Tropical Rainforest Environment[J].Surface Technology,2018,47(9):126-132 |
| 热带雨林环境中典型霉菌对PCB-HASL腐蚀行为的影响 |
| Effect of Typical Molds on PCB-HASL Corrosion Behaviors in Tropical Rainforest Environment |
| 投稿时间：2018-05-08 修订日期：2018-09-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2018.09.017 |
| 中文关键词: PCB-HASL 霉菌 腐蚀 热带雨林 电化学 腐蚀机制 |
| 英文关键词:PCB-HASL mold corrosion rainforest electrochemical corrosion mechanism |
| 基金项目:国家自然科学基金面向项目（51671027） |
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| Author | Institution |
| LI Xue-ming | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| HU Yu-ting | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| YI Pan | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| BAI Zi-heng | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| XIAO Kui | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| DONG Chao-fang | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| LU Lin | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| LI Xiao-gang | 1.Institute of Advanced Materials and Technology, University of Science and Technology Beijing, Beijing 100083, China |
| WEI Dan | 2.Service Center for Societies, China Association for Science and Technology, Beijing 100081, China |
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| 中文摘要: |
| 目的 探究热带雨林环境中典型霉菌作用下PCB-HASL的腐蚀机制。方法 将PCB-HASL试样灭菌后放入机箱，置于西双版纳户外进行2年的暴露试验，经不同周期取回，分析观察试样表面腐蚀情况。将筛选出的典型霉菌孢子液喷洒在无菌试样上，置于湿热环境中，通过激光共聚焦显微镜（3D LSCM）、扫描电子显微镜（SEM）和能谱仪（EDS）分析试样表面形貌和成分，并观察霉菌的生长情况，使用电化学工作站及扫描开尔文探针（SKP）对PCB-HASL表面不同周期霉菌作用下的腐蚀电位进行分析。结果 随着户外暴露周期的增加，PCB-HASL表面腐蚀面积逐渐增加，表面伏打电位先上升后下降。EDS能谱分析结果表明，腐蚀产物中主要含Sn 58.88%，O 30.93%，腐蚀产物主要为Sn的氧化物。木贼镰孢菌（Fusarium equiseti）和光轮层炭壳菌（Daldinia eschscholtzii）覆盖区域腐蚀程度严重，腐皮镰刀菌（Fusarium solani）菌丝生长旺盛，中期腐蚀电位明显降低，由－0.3 V降至－0.52 V。结论 西双版纳热带雨林环境中对PCB-HASL腐蚀作用显著的典型霉菌为Fusarium equiseti、Daldinia eschscholtzii和Fusarium solani，在湿热环境下会造成PCB-HASL的腐蚀，其腐蚀机制主要为薄液膜下的电化学腐蚀。 |
| 英文摘要: |
| The work aims to explore the corrosion mechanisms of PCB-HASLs under typical molds in tropical rainforest. The PCB-HASL samples were sterilized and placed in a cabinet for outdoor exposure for 2 years in Xishuangbanna. The corrosion behaviors of samples taken back from different periods were observed. The selected typical molds spores were sprayed on sterile samples and placed in a hot and humid environment. Morphology, composition and growth of molds were observed and analyzed by laser scanning confocal microscope (3D LSCM), scanning electron microscope (SEM) and energy dispersive spectrometer (EDS). The surface potential of the PCB-HASL samples under different types of molds in different times were analyzed by electrochemical workstation and scanning kelvin probe (SKP). With the increase of exposure time in the outdoor, the corrosion area of the PCB-HASL gradually increased. The surface potential of the PCB-HASL increased at first and then decreased. The results of EDS showed that the corrosion product mainly contained 58.88% of Sn and 30.93% of O, and the corrosion product was mainly oxide of Sn. Corrosion beneath the coverage of Fusarium equiseti and Daldinia eschscholtzii was serious. Fusarium solani grew vigorously which caused a significant reduction of corrosion potential from －0.3 V to －0.52 V in the mid-term. The typical molds having significant effects on the corrosion processes of PCB-HASL in the rainforest of Xishuangbanna are Fusarium equiseti, Daldinia eschscholtzii and Fusarium solani, which can corrode the PCB-HASL in such a hot and humid environment. The corrosion mechanism is mainly the electrochemical corrosion under the thin liquid film. |
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