戚云娟,邓勇生.提高 Ni-Cr 合金薄膜电阻稳定性的工艺研究[J].表面技术,2018,47(8):276-279.
QI Yun-juan,DENG Yong-sheng.Technology Improving the Stability of Ni-Cr Alloy Film Resistance[J].Surface Technology,2018,47(8):276-279
提高 Ni-Cr 合金薄膜电阻稳定性的工艺研究
Technology Improving the Stability of Ni-Cr Alloy Film Resistance
投稿时间:2018-01-18  修订日期:2018-08-20
DOI:10.16490/j.cnki.issn.1001-3660.2018.08.038
中文关键词:  Ni-Cr 合金薄膜  电阻  热处理  保护薄膜  电阻稳定性
英文关键词:Ni-Cr film  resistance  heat treatment  protective film  resistance stability
基金项目:
作者单位
戚云娟 陕西电器研究所,西安 710035 
邓勇生 陕西电器研究所,西安 710035 
AuthorInstitution
QI Yun-juan Shaanxi Institute of Electrical Appliances, Xi'an 710035, China 
DENG Yong-sheng Shaanxi Institute of Electrical Appliances, Xi'an 710035, China 
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中文摘要:
      目的 通过改变沉积 Ni-Cr 合金薄膜厚度、增加保护薄膜及梯度升温热处理工艺,获得电阻稳定性良好的合金薄膜。方法 采用离子束溅射镀膜工艺,沉积 160、230、300 nm 厚的合金薄膜,并沉积 200 nm 厚的 SiO2 保护薄膜,采用梯度升温的方式对薄膜进行真空热处理。通过安捷伦数字繁用表测试试件热处理前后阻值的大小,通过差值计算出阻值变化量,并进行薄膜电阻稳定性研究。结果 与 160 nm 厚的合金薄膜的电阻变化相比,将厚度提高到 300 nm,热处理前后阻值的变化从 25 Ω 减小到 2 Ω。与没有保护膜的合金薄膜热处理前后的阻值变化相比,增加保护膜的阻值从 76 Ω 减小到 25 Ω。与直接升温的薄膜热处理工艺相比,采用阶梯升温的方式进行薄膜热处理的薄膜电阻从 46 Ω减小到了 25 Ω,薄膜电阻稳定性提高。结论 合金膜厚的增加可减小薄膜的边界和杂质效应,有利于提高薄膜的电阻稳定性。增加保护薄膜可阻止外界环境中水汽等对薄膜的影响,阶梯升温方式有利于薄膜残余应力的充分释放,可提高薄膜电阻的稳定性。
英文摘要:
      The work aims to obtain the alloy film with good resistance stability by changing the thickness of the film, increasing the protective film and adopting the Cradient thermo treatment process. Ion beam sputtering process was used to deposit 160 nm and 300 nm thick alloy thin films and 200 nm thick SiO2 protective films. Cradient thermo treatment process was adopted to carry out vacuum heat treatment to thin films. The Agilent digital multimeter was used to test the resistance value before and after heat treatment and the difference value was adopted to calculate the resistance change to study the film resistance stability. Compared with the resistance change in 160 nm alloy thin film, the resistance change in 300 nm thick films before and after heat treatment respectively decreased to 2 Ω from 25 Ω. Compared with the resistance change in alloy thin films without protective film before and after the heat treatment, the resistance change in the film with protective film dropped to 25 Ω from 76 Ω. Compared with the direct heating process of thin film, the resistance change in the film processed by Cradient temperature rising method lowered to 25 Ω from 46 Ω. Moreover, the resistance stability of film improved. The increase of alloy film thickness can reduce the boundary and impurity effects of film and improve the resistance stability of thin film. Increasing the protective film can prevent the water and vapor in the external environment from affecting the film. The Cradient temperature rising method is beneficial for the film to fully release the residual stress and improve the resistance stability of thin film.
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