种详远,甄明晖,仇溢,宗亚平,曹新建,张跃波.α-SiC粉体化学镀铜及其对铁基复合材料性能的影响[J].表面技术,2018,47(3):244-249.
CHONG Xiang-yuan,ZHEN Ming-hui,QIU Yi,ZONG Ya-ping,CAO Xin-jian,ZHANG Yue-bo.Electroless Copper Plating on α-SiC Powder and Its Effect on Properties of α-SiC/Fe Composites[J].Surface Technology,2018,47(3):244-249 |
| α-SiC粉体化学镀铜及其对铁基复合材料性能的影响 |
| Electroless Copper Plating on α-SiC Powder and Its Effect on Properties of α-SiC/Fe Composites |
| 投稿时间：2017-10-25 修订日期：2018-03-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2018.03.039 |
| 中文关键词: α-SiC颗粒 化学镀铜 镀速 镀层 铁基复合材料 力学性能 |
| 英文关键词:α-SiC particle electroless copper plating plating rate coating iron-based composites mechanical property |
| 基金项目:山东省技术创新项目（201620113027，201620113028） |
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| Author | Institution |
| CHONG Xiang-yuan | Shangdong Gold Phoenix Co. Ltd, Dezhou 253000, China |
| ZHEN Ming-hui | Shangdong Gold Phoenix Co. Ltd, Dezhou 253000, China |
| QIU Yi | Shangdong Gold Phoenix Co. Ltd, Dezhou 253000, China |
| ZONG Ya-ping | Key Laboratory for Anisotropy and Texture of Materials of Ministry of Education, Northeastern University, Shenyang 110819, China |
| CAO Xin-jian | Key Laboratory for Anisotropy and Texture of Materials of Ministry of Education, Northeastern University, Shenyang 110819, China |
| ZHANG Yue-bo | Key Laboratory for Anisotropy and Texture of Materials of Ministry of Education, Northeastern University, Shenyang 110819, China |
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| 中文摘要: |
| 目的 优化α-SiC颗粒化学镀铜工艺，改善α-SiC/Fe之间的界面浸润性和匹配性，提高α-SiC/Fe复合材料的力学性能。研究α-SiC粒径大小和镀液工艺对镀铜的影响以及镀铜对α-SiC/Fe复合材料力学性能的影响。方法 在对α-SiC颗粒粗化、敏化和活化后，采用化学镀覆的方式对5、10、15、20 μm四种不同粒径的α-SiC进行表面镀铜。采用SEM和XRD对镀层的表面形貌和物相进行表征，采用SEM对α-SiC/Fe复合材料的显微组织进行观察。结果 4种粒径的α-SiC表面都成功地镀上了铜，且α-SiC颗粒粒径越小，表面积越大，镀速越高。确定了化学镀液的最佳工艺：温度65 ℃，溶液pH值9~11，SnCl2加入量9 g/L，PdCl2加入量1.5 g/L。镀层形貌为凹凸不平的铜粒子集合体，物相为α-SiC、Cu和少量的Cu2O。5、10、15、20 μm的α-SiC颗粒镀铜提高了α-SiC/Fe复合材料的致密度、抗拉强度和延伸率，镀铜后致密度分别提高了0.62%、0.73%、0.95%、1.06%，抗拉强度分别提高了5.58%、10.97%、11.63%、13.02%，延伸率分别提高了6.35%、12.35%、10.19%、10.37%。结论 α-SiC的粒径和镀液工艺显著地影响着镀速和镀层形貌。镀铜能够有效地改善α-SiC/Fe复合材料的界面缺陷，提高其力学性能。 |
| 英文摘要: |
| The work aims to optimize electroless copper plating process of α-SiC particles, enhance interfacial wettability and compatibility between α-SiC and Fe, and improve mechanical properties of α-SiC/Fe composites. Besides, it aims to study effects of α-SiC particle size and plating process on copper plating, and effects of copper plating on mechanical properties of α-SiC/Fe composites. After roughening, sensitization and activation of α-SiC particles, α-SiCs with different particle size of 5, 10, 15 and 20 μm were copper-plated by electroless plating. Surface morphology and phase of the coatings were characterized with SEM and XRD. Microstructures of α-SiC/Fe composites were observed with SEM. As a result, the four kinds of α-SiC surfaces were successfully copper-plated. The smaller the particle size was, the larger the surface area and the higher the plating rate were. The optimum process of electroless plating solution was determined as follows: temperature of 65 ℃, solution pH of 9~11, SnCl2 amount of 9 g/L, and PdCl2 amount of 1.5 g/L. Morphology of the coatings was aggregate of rugged copper particles, phases were α-SiC, Cu and a small amount of Cu2O. Electroless plating of α-SiCs with different particle size of 5, 10, 15 and 20 μm improved density, tensile strength and elongation of α-SiC/Fe composites. The density increased by 0.62%, 0.73%, 0.95% and 1.06%, respectively; tensile strength by 5.58%, 10.97%, 11.63% and 13.02%, respectively; and elongation by 6.35%, 12.35%, 10.19% and 10.37%, respectively. Particle size of α-SiC and plating solution process significantly affect plating speed and coating morphology. Copper plating can effectively improve interface defects of α-SiC/Fe composites and enhance mechanical properties. |
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