毛美姣,吴锋,胡自化.抛光垫特性对硬质合金刀片CMP加工效果的影响[J].表面技术,2017,46(12):270-276.
MAO Mei-jiao,WU Feng,HU Zi-hua.Effects of Polishing Pad Characteristics on CMP (Chemical Mechanical Polishing) Result of Cemented Carbide Tool[J].Surface Technology,2017,46(12):270-276 |
| 抛光垫特性对硬质合金刀片CMP加工效果的影响 |
| Effects of Polishing Pad Characteristics on CMP (Chemical Mechanical Polishing) Result of Cemented Carbide Tool |
| 投稿时间：2017-06-19 修订日期：2017-12-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2017.12.042 |
| 中文关键词: 化学机械抛光 硬质合金刀片 抛光垫 |
| 英文关键词:chemical mechanical polishing cemented carbide tool polishing pad |
| 基金项目:湖南省自然科学基金项目（2017JJ4055）；湖南省科技厅科技计划重点研发项目（2016GK2014） |
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| 中文摘要: |
| 目的 研究不同种类的抛光垫对硬质合金刀片表面化学机械抛光（Chemical Mechanical Polishing/Planarization，CMP）加工过程的影响，为实现硬质合金刀片高效精密CMP加工提供有效参考。方法 利用Nanopoli-100智能抛光机，通过自制的Al2O3抛光液，分别采用9种不同种类的抛光垫对牌号为YG8的硬质合金刀片进行CMP实验，将0～40、40～80、80～120 min三个加工阶段获得的材料去除率和表面粗糙度进行对比，同时观察最佳的表面形貌，分析抛光垫特性对CMP加工效果的影响。结果 在抛光转速60 r/min，抛光压力177.8 kPa的实验条件下，9种不同类型的抛光垫中仅有5种适合用于YG8硬质合金CMP加工。而且抛光垫的表面粗糙度在YG8刀片CMP加工过程中的影响最为显著，抛光垫表面粗糙度越高，CMP加工的材料去除率越高。此外，抛光垫的使用时间对CMP过程也有影响，抛光垫使用时间越长，CMP的材料去除率越小。结论 YG8硬质合金刀片经5种不同类型抛光垫CMP加工后，其表面的烧伤、裂纹等缺陷均得到了极大改善。当使用细帆布加工40 min时，材料去除率最高，为47.105 nm/min；当使用细帆布加工80 min时，表面粗糙度最低，为0.039 μm。 |
| 英文摘要: |
| The work aims to study effects of various polishing pads on surface CMP (chemical mechanical polishing/planarization) process of cemented carbide cutting tools, so as to provide an effective reference for high precision chemical mechanical polishing of cemented carbide tools. With Nanopoli-100 intelligent polishing machine as experimental equipment and homemade alumina polishing fluid as polishing liquid, nine kinds of polishing pads were used to carry out CMP experiments to YG8 carbide cutting tools. Material removal rate and surface roughness in machining periods of 0~40, 40~80 and 80~120 min were compared, optimal surface morphology of the carbide cutting tools was observed, and the effects of pad characteristics on CMP result were analyzed. Provided with polishing speed of 60 r/min and polishing pressure of 177.8 kPa, only five of the polishing pads were suitable for CMP of YG8 cemented carbide tools. The surface roughness of polishing pads had most significant effects on CMP of cemented carbide tools. The higher the surface roughness of polishing pad was, the greater the removal rate of polishing material was. In addition, service time of polishing pads also affected the CMP process. The longer the service time of polishing pads was, the lower the removal rate of CMP material was. After receiving CMP by five different kinds of polishing pads, surface burns and cracks on cemented carbide tools were greatly improved. The maximum material removal rate was 47.105 nm/min after being polished with fine canvas for 40 minutes while the minimum surface roughness was 0.039 after being polished with fine canvas for 80 minutes. |
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