肖忠良,卢意鹏,刘姣,曾鹏,周朝花,吴蓉,吴道新,曹忠.一种化学还原镀金液复合配位剂的研究[J].表面技术,2017,46(6):263-269.
XIAO Zhong-liang,LU Yi-peng,LIU Jiao,ZENG Peng,ZHOU Chao-hua,WU Rong,WU Dao-xing,CAO Zhong.Compound Coordination Agent of Electroless Gold Plating[J].Surface Technology,2017,46(6):263-269
一种化学还原镀金液复合配位剂的研究
Compound Coordination Agent of Electroless Gold Plating
投稿时间:2017-02-22  修订日期:2017-06-20
DOI:10.16490/j.cnki.issn.1001-3660.2017.06.042
中文关键词:  化学还原镀金  复合配位剂  沉积速率  稳定性  结合力  光亮度
英文关键词:chemical reduction gold plating  compound coordination agent  deposition rate  stability  adhesion  brightness
基金项目:国家自然科学基金(31527803,21501015,21545010);湖南省战略性新兴产业科技攻关与重大成果转化项目(2015GK1046)
作者单位
肖忠良 长沙理工大学 化学与生物工程学院,长沙 410114 
卢意鹏 长沙理工大学 化学与生物工程学院,长沙 410114 
刘姣 长沙理工大学 化学与生物工程学院,长沙 410114 
曾鹏 长沙理工大学 化学与生物工程学院,长沙 410114 
周朝花 长沙理工大学 化学与生物工程学院,长沙 410114 
吴蓉 长沙理工大学 化学与生物工程学院,长沙 410114 
吴道新 长沙理工大学 化学与生物工程学院,长沙 410114 
曹忠 长沙理工大学 化学与生物工程学院,长沙 410114 
AuthorInstitution
XIAO Zhong-liang School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
LU Yi-peng School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
LIU Jiao School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
ZENG Peng School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
ZHOU Chao-hua School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
WU Rong School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
WU Dao-xing School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
CAO Zhong School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410114, China 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 研究由乙二胺四乙酸二钠(EDTA-2Na)、乙二胺四亚甲基膦钠(EDTMPS)和柠檬酸三铵(C6H5O7(NH4)3)组成的复合配位剂,在不同浓度及pH下,对金沉积速率、镀金液稳定性、金镀层结构及性能的影响。方法 用化学镀的方法在树脂基体上先预镀覆Cu-Ni-Pd金属层,然后制备金镀层。采用正交实验法,研究复合配位剂浓度及pH对金层沉积速率、镀金液稳定性、结合力、光亮度的影响。借助扫描电镜及能谱,分析不同优化组合镀液配方制备的镀层形貌及成分。结果 以镀金沉积速率为评价指标时的最优组合为A2C3D3B2,以镀液稳定性为评价指标时的最优组合为A2C2B3D2,以镀层结合力为评价指标时的最优组合为A2D2B2C2,以镀层光亮度为评价指标时的最优组合为A3C1D2B2。将4个单一评价指标的最优组合重复实验,实验结果表明,当EDTA-2Na为15 g/L、EDTMPS为3 g/L、C6H5O7(NH4)3为30 g/L、pH为6.0时,镀液稳定性最高,可达6 MTO;镀层沉积速率最快,可达0.0066 µm/min;镀层结合力可达5级,光亮度可达1级。结论 采用EDTA-2Na、EDTMPS和C6H5O7(NH4)3组成的复合配位剂,在适当的pH下能够提高镀层沉积速度及镀液稳定性,改善镀层表面形貌。
英文摘要:
      The work aims to study effects of the compound coordination agent consisting of Disodium Ethylenediamine Tetraacetate (EDTA-2Na), Sodium Ethylenediamine Tetramethylene Phosphonic (EDTMPS) and Ammonium Citrate (C6H5O7(NH4)3) on deposition rate, stability of plating solution as well as structure and properties of gold plating provided with different concentration and pH. The Cu-Ni-Pd metal layer was pre-plated on resin substrate by electroless plating, and then the gold plating was prepared. The effects of concentration and pH of compound coordination agent on deposition rate of gold plating, stability of plating solution, adhesion and brightness were studied by performing orthogonal experiment. Morphology and composition of the plating prepared in different optimized groups of plating solution formula were analyzed with scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The optimum combination was A2C3D3B2 when gold deposition rate was taken as evaluation index, A2C2B3D2 when the stability of plating solution was taken as the evaluation index, A2D2B2C2 when the binding force was taken as the evaluation index, A3C1D2B2 when the adhesion was taken as the evaluation index. The optimum combination of four single evaluation indices was repeated. Provided with 15 g/L of EDTA-2Na, 30 g/L of C6H5O7(NH4)3 and pH of 6.0, the plating deposition rate was the fastest, stability of the plating solution was the highest, up to 6 MTO, adhesion up to level 5, brightness up to level 1. The compound coordination agent consisting of EDTA-2Na, EDTMPS and C6H5O7(NH4)3 in appropriate pH can improve the depositing speed and stability of plating solution, and thereby improve morphology of the plating.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第19494010位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号