钟厉,龙永杰.高离化率物理气相沉积涂层的研究进展[J].表面技术,2017,46(6):96-101.
ZHONG Li,LONG Yong-jie.Study Progress of High Ionization Rate Physical Vapor Deposition Coatings[J].Surface Technology,2017,46(6):96-101
高离化率物理气相沉积涂层的研究进展
Study Progress of High Ionization Rate Physical Vapor Deposition Coatings
投稿时间:2017-01-20  修订日期:2017-06-20
DOI:10.16490/j.cnki.issn.1001-3660.2017.06.015
中文关键词:  高离化率物理气相沉积  膜基结合力  涂层特性  硬质涂层  峰值功率  离子能量
英文关键词:high ionization rate physical vapor deposition  film adhesion  coating characteristics  hard coating  peak power  ion energy
基金项目:
作者单位
钟厉 重庆交通大学 机电与车辆工程学院,重庆 400074 
龙永杰 重庆交通大学 机电与车辆工程学院,重庆 400074 
AuthorInstitution
ZHONG Li School of Mechatronics and Vehicle Engineering, Chongqing Jiaotong University, Chongqing 400074, China 
LONG Yong-jie School of Mechatronics and Vehicle Engineering, Chongqing Jiaotong University, Chongqing 400074, China 
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中文摘要:
      高离化率物理气相沉积是一种新发展起来的脉冲磁控溅射技术(HPPMS),具有溅射靶材原子高度离化与峰值功率超过平均功率等特点。它作为一种新型的离子化物理气相沉积技术,在国内外已经成为一个研究热点,其离子体特性、涂层工艺、高功率脉冲放电等备受国内外学者关注。沉积过程中,离子随着电子碰撞与电荷交换发生电离,并按照双极性扩散理论进行传递。在不同工作气压条件下,离子能量分布表现出不同的特点。在放电过程中使用高的峰值功率脉冲(超出一般沉积技术2~3个数量级)与低脉冲占空比(0.5%~10%)实现高电离(>50%),从而表现出了优良的结合力,在控制涂层结构与降低涂层的内部压力等方面有相当大的优势。从HPPMS技术制备涂层的应用现状出发,介绍了高离化率物理气相沉积涂层的特点、优势以及在制备复合涂层和涂层界面优化等方面的研究进展。探讨了高离化率物理气相沉积涂层的未来发展趋势,对涂层的应用效果进行了分析。
英文摘要:
      As a new pulse magnetron sputtering technology (HPPMS), high ionization rate physical vapor deposition features have high atomic ionization of sputtering target and high peak power exceeding average power by two orders of magnitude. The new ionization physical vapor deposition technology has become a research hotspot at home and abroad. Its plasma characteristics, coating process and high power pulse discharge have drawn attention of scholars at home and abroad. Ions were ionized with charge exchange along with electron collision during deposition, and were delivered in accordance with the theory of ambipolar diffusion transfer. Provided with different working air pressure, ion energy distribution exhibite different characteristics. High peak power pulse and low pulse duty factor (0.5%~10%) are applied during discharge process to achieve high ionization (>50%), which exhibited good adhesion, having overwhelming advantage in controlling coating structure and reducing internal stress of coating. From proceeding application status of preparing coatings using HPPMS technology, this work introduced characteristics and advantages of the high ionization rate physical vapor deposition coating, and research progress in hard coating preparation and coating interface optimization. Future development trend of high ionization rate physical vapor deposition coating was discussed, and application effect of the coatings was analyzed.
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