郑强,蔡苇,陈飞,周杰,兰伟,符春林.氧化铝陶瓷基板化学镀铜工艺优化[J].表面技术,2017,46(4):212-216.
ZHENG Qiang,CAI Wei,CHEN Fei,ZHOU Jie,LAN Wei,FU Chun-lin.Process Optimization of Electroless Copper Plating on Alumina Ceramics Substrate[J].Surface Technology,2017,46(4):212-216 |
| 氧化铝陶瓷基板化学镀铜工艺优化 |
| Process Optimization of Electroless Copper Plating on Alumina Ceramics Substrate |
| 投稿时间：2016-10-28 修订日期：2017-04-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2017.04.034 |
| 中文关键词: 化学镀铜 氧化铝 陶瓷基板 沉积速度 微结构 导电性 |
| 英文关键词:electroless copper plating alumina ceramics substrate deposition rate microstructure conductivity |
| 基金项目:重庆高校创新团队建设计划资助项目(CXTDX201601032) |
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| Author | Institution |
| ZHENG Qiang | School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China |
| CAI Wei | School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China |
| CHEN Fei | Chongqing HongFuCheng Electronic New Material Co., Ltd., Chongqing 402760, China |
| ZHOU Jie | School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China |
| LAN Wei | School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China |
| FU Chun-lin | School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology, Chongqing 401331, China |
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| 中文摘要: |
| 目的 化学镀铜是氧化铝陶瓷基板金属化的一种重要手段，为了进一步优化氧化铝陶瓷基板化学镀铜工艺，研究了化学镀铜液配比（尤其是镀液中铜离子和甲醛含量）对氧化铝陶瓷覆铜板微结构和导电性的影响。方法 在对氧化铝陶瓷基板经过前期处理后，采用化学镀铜法在基板上镀铜。采用X射线衍射仪、光学显微镜对氧化铝基板上的化学镀铜层物相和形貌进行观察。采用覆层测厚仪、四探针测试仪对化学铜镀层的膜厚和方阻进行测量。结果 XRD结果表明，不同配比镀液得到的化学镀铜层均具有较好的晶化程度，镀液中甲醛和铜含量较低的镀液可制备出晶粒更为细小的化学镀铜层。甲醛和铜离子含量均较高时，沉积速度过快，使镀铜层的均匀性和致密性不佳。但当甲醛含量较高、铜离子含量较低时，沉积速度适中，从而获得了均匀性和致密性较好的镀铜层，同时这种镀层具有良好的导电性。结论 采用表面活性化学镀铜工艺，当镀液中甲醛浓度为0.25 mol/L和硫酸铜质量浓度为1.2 g/L时，无需高温热处理，即获得了均匀性和致密性俱佳的铜镀层，可满足覆铜板的使用要求。 |
| 英文摘要: |
| Electroless copper plating is an important measure of metalizing surface of alumina ceramic substrate. The work aims to further optimize the process of electroless copper plating on alumina ceramic substrate by studying the effects of chemical copper plating bath proportion (especially content of copper ion and formaldehyde in the bath) on microstructure and electrical conductivity of copper coating. After pretreatment of alumina ceramics substrate, copper coating on the substrate was carried out by virtue of electroless copper plating. Phase and morphology of the coating subject to electroless copper plating on alumina substrate were observed with X-ray diffractometer and optical microscope, respectively. The coating thickness and sheet resistance of the coating subject to electroless copper plating on alumina substrate were measured by coating thickness gauge and four-probe tester, respectively. XRD results showed that all coatings subject to electroless copper plating prepared in different proportion exhibited better crystallinity. Moreover, plating bath of lower content of formaldehyde and copper could be used to produce copper coating with fine grains. The deposition rate was high when the content of formaldehyde and copper ion was high, leading to poor compactness and uniformity of copper coating. Meanwhile, the deposition rate was moderate when the content of formaldehyde content was higher and the content of copper ion was lower, leading to better uniformity, compactness and conductivity of the copper coating. When the concentration of formaldehyde and copper sulphate is 0.25 mol/L and 1.2 g/L respectively, copper coating of good uniformity and compactness is prepared by surface active copper plating process without high temperature heat treatment, meeting application requirements of copper-clad laminates. |
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