陈昌浩,金永中,刘东亮,余学金.负偏压对多弧离子镀 TiN 涂层大颗粒形貌及像素分布的影响[J].表面技术,2015,44(11):29-34.
CHEN Chang-hao,JIN Yong-zhong,LIU Dong-liang,YU Xue-jin.Influence of Negative Bias Voltage on Microparticles Morphology and Pixel Distribution of TiN Coatings Deposited by Multi-arc Ion Plating[J].Surface Technology,2015,44(11):29-34
负偏压对多弧离子镀 TiN 涂层大颗粒形貌及像素分布的影响
Influence of Negative Bias Voltage on Microparticles Morphology and Pixel Distribution of TiN Coatings Deposited by Multi-arc Ion Plating
投稿时间:2015-07-21  修订日期:2015-11-20
DOI:10.16490/j.cnki.issn.1001-3660.2015.11.005
中文关键词:  多弧离子镀  TiN 涂层  负偏压  ImageJ 软件  大颗粒  像素分布
英文关键词:multi-arc ion plating  TiN coatings  negative bias voltage  ImageJ software  microparticles  pixel distribution
基金项目:四川省教育厅项目(15ZA0232);四川理工学院科研培育项目(2014PY10)
作者单位
陈昌浩 四川理工学院 材料与化学工程学院, 四川 自贡 643000 
金永中 四川理工学院 材料与化学工程学院, 四川 自贡 643000 
刘东亮 四川理工学院 材料与化学工程学院, 四川 自贡 643000 
余学金 四川理工学院 材料与化学工程学院, 四川 自贡 643000 
AuthorInstitution
CHEN Chang-hao School of Material and Chemical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China 
JIN Yong-zhong School of Material and Chemical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China 
LIU Dong-liang School of Material and Chemical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China 
YU Xue-jin School of Material and Chemical Engineering, Sichuan University of Science and Engineering, Zigong 643000, China 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 分析不同负偏压下 TiN 涂层表面的大颗粒数量、尺寸和面积以及像素分布,为多弧离子镀技术的工业化应用提供基础数据。 方法 采用多弧离子镀膜技术,以脉冲负偏压为变量,在硬质合金表面沉积 TiN 涂层。 用扫描电子显微镜对涂层表面形貌进行表征,并利用 ImageJ 软件对表面大颗粒的数量和尺寸进行分析,对像素分布进行统计。 结果 随着负偏压的增加,涂层表面大颗粒的数量先增多,后减少。 负偏压为 100 V 时,大颗粒数量最多,为 1364;负偏压为 300 V 时,大颗粒数量最少,为 750。 此外随着负偏压的增加,大颗粒所占涂层面积比逐渐减小。 未加负偏压时,涂层表面大颗粒所占面积比最大,为 6. 9% ,且此时涂层的力学性能最差;采用 400 V 负偏压时,涂层表面大颗粒所占面积比最小,为3. 3% ,且此时涂层的力学性能最好。 负偏压为 300 V 时,亮、暗像素点的个数最多,为 8302;负偏压为 400 V 时,亮、暗像素点的个数最少,为 4067。 结论 当占空比为 30% ,沉积时间为 1 h,负偏压为 400 V 时,获得的涂层力学性能最好,颗粒数量少且尺寸小。
英文摘要:
      Objective To analyze the microparticles (MPs) morphology and pixel distribution of TiN coatings under different negative bias voltage (0, 100, 200, 300 and 400V), so as to provide basic data for industrial applications of multi-arc ion plating. Methods TiN coatings were deposited on hard alloy surface by multi-arc ion plating at different bias voltage. The surface morphology of TiN coatings was characterized by scanning electron microscope (SEM). At the same time, the amount and size of MPs were analyzed and the distribution of pixel was counted by ImageJ software. Results The amount of MPs on coating surface increased at first and then decreased with the increase of bias voltage. The maximum value was 1364 at 100 V and the minimum was 750 at 300 V. In addition, the area ratio of MPs on coating surface decreased gradually with the increase of bias voltage. The maximum value with worst mechanical properties was 6. 9% at 0 V and the minimum with best mechanical properties was 3. 3% at 400 V. The amount of light and dark pixel reached a maximum of 8302 at 300 V and a minimum of 4067 at 400 V. Conclusion The TiN coatings with best mechanical properties, low amount and small size of MPs were deposited at 400 V for 1 h with 30% duty cycle.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第20083890位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号