唐囡,杨又华,邓静伟,周建萍,刘志雷,刘光明.双酚 A 型酚醛树脂改性双氰胺固化环氧树脂行为的研究[J].表面技术,2014,43(6):144-148.
TANG Nan,YANG You-hua,DENG Jing-wei,ZHOU Jian-ping,LIU Zhi-lei,LIU Guang-ming.Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin[J].Surface Technology,2014,43(6):144-148
双酚 A 型酚醛树脂改性双氰胺固化环氧树脂行为的研究
Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin
投稿时间:2014-06-14  修订日期:2014-12-10
DOI:
中文关键词:  酚醛  双氰胺  潜伏固化剂  改性
英文关键词:phenolic aldehyde  dicyandiamide  latent curing agent  modification
基金项目:国家电网公司科技项目(521820130014)
作者单位
唐囡 国网江西省电力科学研究院, 南昌 330096 
杨又华 国网江西省电力科学研究院, 南昌 330096 
邓静伟 国网江西省电力科学研究院, 南昌 330096 
周建萍 南昌航空大学, 南昌 330063 
刘志雷 南昌航空大学, 南昌 330063 
刘光明 南昌航空大学, 南昌 330063 
AuthorInstitution
TANG Nan State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China 
YANG You-hua State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China 
DENG Jing-wei State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China 
ZHOU Jian-ping Nanchang Hangkong University, Nanchang 330063, China 
LIU Zhi-lei Nanchang Hangkong University, Nanchang 330063, China 
LIU Guang-ming Nanchang Hangkong University, Nanchang 330063, China 
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中文摘要:
      目的 得到一种低温快速固化的潜伏性双氰胺固化剂。 方法 利用红外光谱对合成的新型双酚 A 型酚醛树脂改性双氰胺潜伏性固化剂的结构进行表征,研究双氰胺和酚醛不同配比对固化漆膜性能的影响,采用示差扫描量热(DSC)分析研究改性后固化剂的活性、用量及固化温度。 结果 双氰胺和酚醛较好的摩尔比为 0. 6 : 1,改性固化剂的最佳用量为 30% (相对环氧树脂的质量分数),改性后的恒温固化温度为 127 ℃ 。 结论 该配方合成的双酚 A 型酚醛树脂改性双氰胺固化剂具有最好的综合性能。
英文摘要:
      Objective To obtain a latent, low-temperature and fast curing dicyandiamide agent. Methods A new latent curing agent of dicyandiamide modified by bisphenol A type phenolic aldehyde resin was synthesized and the structure was characterized by FTIR spectra. The impact of dicyandiamide dosage on product performance was investigated. The activity of the modified curing a- gent, the dosage and the curing temperature were studied with differential scanning calorimetry (DSC). Results The results showed that the suitable molar ratio of dicyandiamide and phenolic aldehyde was 0. 6 : 1, the optimal dosage of the modified curing agent was 30% (relative to the epoxy resin mass fraction), and the constant curing temperature after modification was 127 ℃. Conclu- sions The resulting curing agent of bisphenol A phenolic resin modified dicyandiamide exhibited the best comprehensive perform- ances.
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