唐囡,杨又华,邓静伟,周建萍,刘志雷,刘光明.双酚 A 型酚醛树脂改性双氰胺固化环氧树脂行为的研究[J].表面技术,2014,43(6):144-148.
TANG Nan,YANG You-hua,DENG Jing-wei,ZHOU Jian-ping,LIU Zhi-lei,LIU Guang-ming.Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin[J].Surface Technology,2014,43(6):144-148 |
| 双酚 A 型酚醛树脂改性双氰胺固化环氧树脂行为的研究 |
| Research on the Behavior of Dicyandiamide Modified by Bisphenol-A Type Phenolic Aldehyde Curing Epoxy Resin |
| 投稿时间：2014-06-14 修订日期：2014-12-10 |
| DOI： |
| 中文关键词: 酚醛 双氰胺 潜伏固化剂 改性 |
| 英文关键词:phenolic aldehyde dicyandiamide latent curing agent modification |
| 基金项目:国家电网公司科技项目(521820130014) |
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| Author | Institution |
| TANG Nan | State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China |
| YANG You-hua | State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China |
| DENG Jing-wei | State Grid Jiangxi Electric Power Research Institute, Nanchang 330096, China |
| ZHOU Jian-ping | Nanchang Hangkong University, Nanchang 330063, China |
| LIU Zhi-lei | Nanchang Hangkong University, Nanchang 330063, China |
| LIU Guang-ming | Nanchang Hangkong University, Nanchang 330063, China |
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| 中文摘要: |
| 目的 得到一种低温快速固化的潜伏性双氰胺固化剂。 方法 利用红外光谱对合成的新型双酚 A 型酚醛树脂改性双氰胺潜伏性固化剂的结构进行表征,研究双氰胺和酚醛不同配比对固化漆膜性能的影响,采用示差扫描量热(DSC)分析研究改性后固化剂的活性、用量及固化温度。 结果 双氰胺和酚醛较好的摩尔比为 0. 6 : 1,改性固化剂的最佳用量为 30% (相对环氧树脂的质量分数),改性后的恒温固化温度为 127 ℃ 。 结论 该配方合成的双酚 A 型酚醛树脂改性双氰胺固化剂具有最好的综合性能。 |
| 英文摘要: |
| Objective To obtain a latent, low-temperature and fast curing dicyandiamide agent. Methods A new latent curing agent of dicyandiamide modified by bisphenol A type phenolic aldehyde resin was synthesized and the structure was characterized by FTIR spectra. The impact of dicyandiamide dosage on product performance was investigated. The activity of the modified curing a- gent, the dosage and the curing temperature were studied with differential scanning calorimetry (DSC). Results The results showed that the suitable molar ratio of dicyandiamide and phenolic aldehyde was 0. 6 : 1, the optimal dosage of the modified curing agent was 30% (relative to the epoxy resin mass fraction), and the constant curing temperature after modification was 127 ℃. Conclu- sions The resulting curing agent of bisphenol A phenolic resin modified dicyandiamide exhibited the best comprehensive perform- ances. |
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