樊爱珍.基于有限元的电感器线圈镀铜工艺仿真分析[J].表面技术,2014,43(5):25-28,65.
FAN Ai-zhen.Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite Element[J].Surface Technology,2014,43(5):25-28,65 |
| 基于有限元的电感器线圈镀铜工艺仿真分析 |
| Simulation Analysis of Copper Electroplating of Inductor Coils Based on Finite Element |
| 投稿时间：2014-05-04 修订日期：2014-06-21 |
| DOI： |
| 中文关键词: 电镀动力学 移动网 格 计算机仿真 电镀模型 |
| 英文关键词:plating kinetics moving mesh computer simulation plating model |
| 基金项目:陕西省教育厅立项课题( 11 Z14) |
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| 中文摘要: |
| 目 的 优化电感器线圈 电镀工艺, 研究电感线圈 电镀过程中 电流、电解质电势和镀层厚度分布规律。 方法 采用 计算机仿真技术, 基于电镀动力 学、电 化学理论、法拉第 定理和移动网 格理论, 建立电感线圈 匝数参数化的三维电 感器线圈 电 镀模型。 结果 电 感线圈 外部的 铜离 子浓度较高, 大约 为 309mol /m3。 电感线圈 最外圈 的电镀厚度最厚, 约 7. 3141 μm。 线圈 外部较大的电流导致电镀线圈 外侧出 现较大的沉积速率。 结论 电解的铜离 子的质量传递是影响电镀动力学的最主要因 素, 线圈 电镀层厚度与电镀活性面上的电流分布相互作用 。 该电镀模型可用 于分析线圈 匝数对电镀工艺的影响, 优化设计类似电镀工艺, 研究电镀机理。 |
| 英文摘要: |
| Objective To optimize the electroplating process of the inductor coil and study the current distribution, the electrolyte potential and the coating thickness distribution during the electroplating process of the inductor coil. Methods The computer simulation technology was used to build a three-dimensional inductor coil plating model with regards to parameterized coil turns based on plating kinetics, electrochemistry theory, Faraday theorem, and moving mesh model. Results The external part of inductor had a high copper concentration of about 309 mol/m3 ; the outermost plating inductor coil had the highest thickness of about 7. 3141 μm; the larger current in the external coil resulted in a larger plating deposition rate for the outer coil. Conclusion The mass transfer of electrolytic copper ion has the main effect on the plating kinetics. The plating thickness interacts with the current distribution on the active plating surface. The plating model can be used to analyze the impact of different plating turns on the plating process, the optimization design of similar electroplating process and the study of electroplating mechanism. |
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