郭瑞,朱绍峰,吴真先.化学沉积 Ni-P-荧光粉复合镀层及其性能研究[J].表面技术,2014,43(4):74-77,123.
GUO Rui,ZHU Shao-feng,WU Zhen-xian.Preparation and Performance Study of Electroless Ni-P-Phosphor Composite Plating[J].Surface Technology,2014,43(4):74-77,123 |
| 化学沉积 Ni-P-荧光粉复合镀层及其性能研究 |
| Preparation and Performance Study of Electroless Ni-P-Phosphor Composite Plating |
| 投稿时间：2014-02-17 修订日期：2014-03-27 |
| DOI： |
| 中文关键词: 化学镀 Ni-P-荧光粉复合镀 搅拌 荧光性能 |
| 英文关键词:electroless plating Ni-P-phosphor composite coatings stirring fluorescence property |
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| 中文摘要: |
| 目的 以铜合金为基体,采用化学镀技术制备 Ni-P-荧光粉复合镀层。 方法 在化学镀镍液中加入荧光粉微粒,在不同条件下施镀,并对不同工艺参数下获得的镀层的表面形貌、结构和荧光特性进行研究。 结果 化学沉积 Ni-P-荧光粉复合镀层的沉积方式为颗粒堆积,镀液中荧光粉的浓度和镀液的 pH值对镀层中荧光粉的含量有影响。 荧光粉微粒的加入使得镀层表面色泽变暗,外观较粗糙。 对复合镀层进行荧光分析发现,激发光谱在激发波长 450 ~ 560 nm 范围内存在荧光峰,发射光谱在发射波长 420 ~500 nm 范围内存在荧光峰。 结论 采用合理的工艺参数可以获得 Ni-P-荧光粉复合镀层,且镀液 pH = 5 .0 时,荧光效果最佳。 |
| 英文摘要: |
| Objective Ni-P-phosphor composite coatings were prepared on the copper substrate by electroless plating. Methods Under the condition of different plating, fluorescent particles were added into the electroless plating solution. Surface morphology, structure and fluorescence properties under different process parameters were investigated using SEM, XRD and fluorescence spectrophotometer. Results The results indicated that particle packing was the depositional mode of Ni-P-phosphor powder composite plating. The phosphor concentration and pH in the plating solution influenced the content of phosphor in the coatings. The surface of composite plating was darkened and showed rough appearance compared to that of electroless Ni-P plating because of the addition of phosphor particles. And fluorescence analysis was carried out on the coating, fluorescence peaks were found when the excitation spectra ranged from 450 to 560 nm while the emission spectra ranged from 420 to 500 nm, which was combined to verify the fluorescence property of the plating. Conclusion Rational process conditions could result in Ni-P-Phosphor Composite Plating and the optimal fluorescent effect was obtained at pH 5. 0. |
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