林燕,江小勇,魏喆良.甲基磺酸盐体系下铜粉浸镀锡工艺的研究[J].表面技术,2014,43(2):89-94.
LIN Yan,JIANG Xiao-yong,WEI Zhe-liang.Technology of Immersion Tin Plating onto Copper Powder in Methyl Sulfonate System[J].Surface Technology,2014,43(2):89-94 |
| 甲基磺酸盐体系下铜粉浸镀锡工艺的研究 |
| Technology of Immersion Tin Plating onto Copper Powder in Methyl Sulfonate System |
| 投稿时间：2013-11-14 修订日期：2013-12-26 |
| DOI： |
| 中文关键词: 浸镀锡 甲基磺酸锡 铜粉 镀层 |
| 英文关键词:immersion tin methyl sulfonate system copper powder plating |
| 基金项目:福州大学科技发展基金资助项目(2011-XQ-013) |
|
|
|
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 解决现有氯化盐体系和硫酸盐体系下,铜粉浸镀锡存在的问题。 方法 以甲基磺酸锡为主盐,硫脲为络合剂,对铜粉进行浸镀锡,并分析锡离子浓度、硫脲浓度、甲基磺酸加入量及镀液温度等因素对锡镀层微观形貌的影响。 结果 在甲基磺酸盐体系下,锡离子可与硫脲形成复杂络合离子,降低了锡离子的平衡电极电位,使铜粉浸镀锡成为可能。 结论 当锡离子浓度为 0 . 15 mol / L,硫脲浓度为 0 . 80mol / L,甲基磺酸加入量为 50 mL / L,镀液温度为 75 ℃ 时,可获得均匀、致密且与铜粉表面结合良好的镀锡层。 |
| 英文摘要: |
| Objective To solve the immersion tin problems existing in chloride system and sulfate system. Methods This paper used tin methane sulfonate as main salt and thiourea as complexing agent to immerse tin plating onto copper powder. And the influences of thiourea concentration, tin ion concentration, methyl sulfonic acid addition and bath temperature on the microstructure of tin plating were studied. Results The results showed that the tin ions could form complex ions with thiourea, which would reduce the equilibrium electrode potential of tin ions, and make it possible for immersion tin plating to immerse onto copper powder in methyl sulfonate system. Conclusion When the tin ion concentration was 0. 15 mol / L, the thiourea concentration was 0. 80 mol / L,the concentration of methane sulfonic acid was 50 mL / L, the solution temperature was 75 ℃ , a uniform and dense tin coating with a good combination with copper surface could be obtained. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号