许斌,邹洪庆.镍磷合金表面电化学蚀刻层的性能表征[J].表面技术,2013,42(6):18-22.
XU Bin,ZOU Hong-qing.Performance Characterization of Electrochemical Etching Coating on Ni-P Alloy[J].Surface Technology,2013,42(6):18-22
镍磷合金表面电化学蚀刻层的性能表征
Performance Characterization of Electrochemical Etching Coating on Ni-P Alloy
投稿时间:2013-10-08  修订日期:2013-11-01
DOI:
中文关键词:  镍磷合金镀层  电化学蚀刻  多孔蚀刻层
英文关键词:nickel-phosphorus alloy coating  electrochemical etching  porous etching coating
基金项目:
作者单位
许斌 西南技术工程研究所, 重庆 400039;国防科技工业自然环境试验研究中心, 重庆 400039 
邹洪庆 西南技术工程研究所, 重庆 400039;国防科技工业自然环境试验研究中心, 重庆 400039 
AuthorInstitution
XU Bin Southwest Technology and Engineering Research Institute, Chongqing 400039, China;Weathering Test and Research Center of Science Technology and Industry for National Defense, Chongqing 400039, China 
ZOU Hong-qing Southwest Technology and Engineering Research Institute, Chongqing 400039, China;Weathering Test and Research Center of Science Technology and Industry for National Defense, Chongqing 400039, China 
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中文摘要:
      目的 研究镍磷合金镀层经电化学蚀刻后的表面特性。 方法 对镍磷合金镀层进行电化学蚀刻,表征蚀刻层的外观形貌、显微形貌、物相结构、元素成分及蚀刻深度,测定蚀刻层的硬度,通过热震试验测试蚀刻层的结合强度,通过极化曲线表征蚀刻微孔的穿透性。 结果 电化学蚀刻后,镍磷合金层表面会逐渐失光,颜色变暗。 电化学蚀刻微孔最初在胞状物边界产生,随后扩展至胞状物表面。 结论 在较佳的蚀刻条件下,蚀刻层微孔大小合适,均匀分布,且孔深合适,没有微孔穿透至基底层。 电化学蚀刻使表面硬度有所下降,而对蚀刻层的结合强度影响不大。
英文摘要:
      Objective The characteristics of Ni-P alloy coating after electrochemical etching were investigated.Methods Ni-P alloy coating was etched by the electrochemical etching method. The surface, microstructure, phase composition, elementary composition and etching depth were characterized. The hardness of etching coating was tested by the microhardness tester. The binding strength between etching coating and substrate was tested by thermal shock technology. The penetration of etching micropores was characterized by using polarization curves. Results The results showed that: the surface of Ni-P alloy after electrochemical etching would turn tarnish and dark. The electrochemical etching micropores first appeared on borders of the cellular materials,then spread to the surface of cellular materials.The etching micropores were in right size and distributed evenly under optimal conditions of electrochemical etching.The etching micropore didn爷 t penetrate the Ni-P alloy layer to the substrate. Conclusion The electrochemical etching had little effect on the binding strength, but reduced the hardness of the etching layer.
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