李远会,万明攀,陈阵,张晓燕,郭忠诚.电镀 Cu-W-Ni 合金的热力学分析[J].表面技术,2013,42(5):8-10.
LI Yuan-hui,WAN Ming-pan,CHEN Zhen,ZHANG Xiao-yan,GUO Zhong-cheng.Thermodynamics Analysis of Electrodeposited Cu-W-Ni Alloys[J].Surface Technology,2013,42(5):8-10 |
| 电镀 Cu-W-Ni 合金的热力学分析 |
| Thermodynamics Analysis of Electrodeposited Cu-W-Ni Alloys |
| 投稿时间：2013-05-22 修订日期：2013-06-30 |
| DOI： |
| 中文关键词: 电镀 Cu-W-Ni 合金 E-pH 图 热力学 |
| 英文关键词:electrodeposition Cu-W-Ni alloys potential-pH plots thermodynamics |
| 基金项目:国家自然科学基金(50964008) ;贵州省科学技术基金黔科合 J 字[2012]2114 号 |
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| Author | Institution |
| LI Yuan-hui | Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China; |
| WAN Ming-pan | Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China |
| CHEN Zhen | Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology, Kunming 650039 , China |
| ZHANG Xiao-yan | Faculty of Materials and Metallurgy, University of Guizhou, Guiyang 550003 , China |
| GUO Zhong-cheng | Faculty of Metallurgical and Energy Engineering,Kunming University of Science and Technology, Kunming 650039 , China |
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| 中文摘要: |
| 借助 25 ℃ 下的 Cu-H2O,Ni-H2O 和 W-H2O 的 E-pH 图,说明了电镀 Cu,W,Ni 的可能性及范围,并重点分析了电镀 Cu-W-Ni 合金的可能性。 Cu-Ni 能在 Cu-H2O 与 Ni-H2O 系 E-pH 图叠合形成的共沉积区里析出。 因 Cu-H2O 与 W-H2O 系的 E-pH 图叠合时无法形成 Cu-W 的共沉积区,Cu-W 不能在其对应离子的水溶液中析出,但 Ni-W 能在 Ni2+,WO42-水溶液里诱导共沉积。 理论和实验证明,在含 Cu2+,Ni2+,WO42-的水溶液中能电镀制备 Cu-W-Ni 合金。 |
| 英文摘要: |
| Theoretically expression of Cu, Ni, W and Cu-W-Ni alloys electrodeposition possibility were thermodynamically analyzed by means of the potential-pH plots of Cu-H2O, Ni-H2O and W-H2O at 25 ℃ normal temperature. It is found that Cu-Ni alloys can be deposited together in the thermodynamical stable region of the Cu-H2O, Ni-H2O potential-pH plots. Cu-W alloys aren't deposited without no thermodynamical stable region of the Cu-H2O, W-H2O potential-pH plots, only if Cu-W-Ni induced electrodeposition under the Ni2+circumstances. It is possible that Ni-W alloys are prepared by the electrodeposition in the theory and experiment, which will be new method and theory for Cu-W-Ni serial contact materials' preparation. |
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