唐娇,盛国军,李德良,刘慎,罗洁,杨焰,李乐,张云亮.“ 金-硫氰酸根冶 配合物的合成及沉金性能研究[J].表面技术,2013,42(2):60-62. TANG Jiao,SHENG Guo-jun,LI De-liang,LIU Shen,LUO Jie,YANG Yan,LI Le,ZHANG Yun-liang.Synthesis of Aurous-thiocyanate Complex and Study on Its Gold Deposition Properties[J].Surface Technology,2013,42(2):60-62 |
“ 金-硫氰酸根冶 配合物的合成及沉金性能研究 |
Synthesis of Aurous-thiocyanate Complex and Study on Its Gold Deposition Properties |
投稿时间:2012-11-01 修订日期:2012-12-03 |
DOI: |
中文关键词: 金配合物 硫氰酸根 合成 化学沉金 |
英文关键词:aurous complex thiocyanate synthesis gold chemical deposition |
基金项目:国家自然科学基金(20976201) ;湖南省自然科学基金(07JJ6156) ;长沙市科技计划项目( K1101257) ;湖南省科技计划项目(2010FJ4257) |
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Author | Institution |
TANG Jiao | Central South University of Forestry & Technology, Changsha 410004 , China |
SHENG Guo-jun | Central South University of Forestry & Technology, Changsha 410004 , China |
LI De-liang | Central South University of Forestry & Technology, Changsha 410004 , China |
LIU Shen | Central South University of Forestry & Technology, Changsha 410004 , China |
LUO Jie | Central South University of Forestry & Technology, Changsha 410004 , China |
YANG Yan | Central South University of Forestry & Technology, Changsha 410004 , China |
LI Le | Changsha Pt-shark Environmental Hi-tech Corp. Ltd. , Changsha 410007 , China |
ZHANG Yun-liang | Changsha Pt-shark Environmental Hi-tech Corp. Ltd. , Changsha 410007 , China |
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中文摘要: |
以氯化亚金和硫氰酸盐为原料,采用“ 选择性还原-络合冶 的方法首次合成了“ 金-硫氰酸根冶 配合物,并通过元素分析确定其分子式为 NH4[ Au( SCN)2] 。 按 PCB 行业的相关工艺要求,对该配合物的化学镀金性能进行了探讨,得到最佳沉金工艺条件为: pH 值 2 ~ 5 , 金质量浓度 1 ~ 3 g / L, 温度 40 ~ 60 ℃ , 施镀时间 9 ~ 12min。 在此条件下所得的沉金层厚度可达 0 . 12 μm,满足相关行业的品质要求。 |
英文摘要: |
We used aurous chloride and thiocyanate as raw materials, with method of " Selective reduction-complexation" , for the synthesis of " Au-thiocyanate" complex, and determined its molecular formula-NH4[ Au ( SCN)2] by elemental analysis. According to the relevant technology of PCB industry, chemical plating properties of the complexes were discussed, and we got the best process condition: pH = 2 ~ 5 , aurous concentration 1 ~ 3 g / L, temperature 40 ~ 60 ℃ , plating time 9 ~ 12min, respectively. Under this condition resulting gold layer thickness of 0 . 12 μm, which can meet the quality requirement of the related industries. |
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