郭锋,尹建代,李鹏飞.镁合金微弧氧化层化学镀镍的镍盐活化工艺研究[J].表面技术,2012,(6):62-64,67.
GUO Feng,YIN Jian-dai,LI Peng-fei.Study on Nickel Salt Activation Process for Electroless Nickel Plating on MAO Ceramic Layer of Magnesium Alloy[J].Surface Technology,2012,(6):62-64,67
镁合金微弧氧化层化学镀镍的镍盐活化工艺研究
Study on Nickel Salt Activation Process for Electroless Nickel Plating on MAO Ceramic Layer of Magnesium Alloy
投稿时间:2012-08-14  修订日期:2012-12-20
DOI:
中文关键词:  镁合金  陶瓷层  化学镀镍  无钯活化
英文关键词:magnesium alloy  ceramic layer  electroless nickel plating  nickel salt activation
基金项目:教育部高等学校博士学科专项科研基金项目(20091514110003)
作者单位
郭锋 内蒙古工业大学材料科学与工程学院, 呼和浩特010051 
尹建代 内蒙古工业大学材料科学与工程学院, 呼和浩特010051 
李鹏飞 内蒙古工业大学材料科学与工程学院, 呼和浩特010051 
AuthorInstitution
GUO Feng College of Material Science and Engineering, Inner Mongolia University of Technology, Hohhot 010051, China 
YIN Jian-dai College of Material Science and Engineering, Inner Mongolia University of Technology, Hohhot 010051, China 
LI Peng-fei College of Material Science and Engineering, Inner Mongolia University of Technology, Hohhot 010051, China 
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中文摘要:
      通过差热分析、扫描电镜?斓仁侄?对镁合金微弧氧化层化学镀镍的镍盐活化工艺进行了研究,并与钯盐活化的效果进行了对比。结果表明:用镍盐对镁合金微弧氧化陶瓷层进行化学镀镍的活化是可行的,活化需要通过活化液室温浸泡和热还原两个步骤完成,活化液配方和热还原工艺是影响活化效果的重要因素;与钯盐活化相比,镍盐活化后化学镀镍的镀速低,最终形成的镀层厚度小,但有利于保持化学镀液在施镀过程中的稳定性。
英文摘要:
      By the means of DSC and SEM, the nickel salt activation process for electroless nickel plating on MAO ceramic layer of magnesium alloy was studied, the activation effect of nickel salt was compared with that of palladium salt. The results show that, nickel salt is practicable to activation of MAO ceramic layer before electroless nickel plating. The activation process includes impregnation in the activator at room temperature and thermal reduction two steps, the activator formula and the thermal reduction process are two important influence factors to activation effect. Comparing the activation effect of nickel salt with palladium salt, the deposition rate of electroless is lower and ultimate thickness of plating layer is thinner, however, the stability of plating solution is better during the plating.
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