彭进,夏琳,邹文俊.化学机械抛光液的发展现状与研究方向[J].表面技术,2012,(4):95-98.
PENG Jin,XIA Lin,ZOU Wen-jun.Research status and Prospect of Chemical Mechanical Polishing Slurry[J].Surface Technology,2012,(4):95-98 |
| 化学机械抛光液的发展现状与研究方向 |
| Research status and Prospect of Chemical Mechanical Polishing Slurry |
| 投稿时间：2012-03-29 修订日期：2012-08-20 |
| DOI： |
| 中文关键词: 化学机械抛光液 二氧化硅 二氧化铈 氧化铝 纳米金刚石 |
| 英文关键词:CMP slurry SiO2 Al2O3 CeO2 Nanodiamond |
| 基金项目:河南省教育厅自然科学基金(12A430005) |
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| 中文摘要: |
| 简述了化学机械抛光液的主要成分及其作用;综述了近年来国内外化学机械抛光液的发展现状,主要介绍了二氧化硅胶体抛光液、二氧化铈抛光液、氧化铝抛光液、纳米金刚石抛光液。最后指出,化学机械抛光液未来应向环保化、精细化以及专门化的方向发展。 |
| 英文摘要: |
| The main composition and function of chemical mechanical polishing(CMP)slurry were elaborated. The developing status of CMP surry in recent years was summarized. It mainly introduced SiO2 sol polishing slurry, Al2O3 polishing slurry, CeO2 polishing slurry, nanodiamond polishing slurry. Finally, the research trends of CMP slurry were pointed out which were environmental protection, refinement, hyperspecialization. |
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