郑朝銮,沈丽.等离子体处理条件对聚酰亚胺薄膜表面处理效果的影响[J].表面技术,2012,(3):90-93.
ZHENG Chao-luan,SHEN Li.The Effect of Different Plasma Treatment Conditions on the Surface Properties of Polyimide Film[J].Surface Technology,2012,(3):90-93 |
| 等离子体处理条件对聚酰亚胺薄膜表面处理效果的影响 |
| The Effect of Different Plasma Treatment Conditions on the Surface Properties of Polyimide Film |
| 投稿时间：2012-01-27 修订日期：2012-06-20 |
| DOI： |
| 中文关键词: 氧气 等离子体处理 聚酰亚胺薄膜 润湿性 剥离强度 |
| 英文关键词:oxygen plasma treatment polyimide film wettability peel strength |
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| 中文摘要: |
| 采用氧气等离子体对聚酰亚胺薄膜进行表面处理,系统研究了等离子体处理时间、压强和功率对处理效果的影响,并对比了空气、氮气、氧气和氩气几种处理气氛的处理效果,得出了最佳处理条件。分析表明:聚酰亚胺薄膜经氧气等离子体处理后,表面引入了含氧极性基团,有明显的刻蚀现象,使得其亲水性增强,与铜箔复合的剥离强度提高。 |
| 英文摘要: |
| Surface treatments of polyimide(PI)film were carried out with oxygen plasma. The effect of plasma treatment conditions such as time, pressure and power on the surface properties of PI film has been investigated. The neat effect of air, nitrogen, oxygen and argon were compared and the optimum treatment conditions were obtained. Analysis of PI film indicated that the oxygen content on the surface increased and there was obviously etching on the PI film surface. The wettability of PI film increased after oxygen plasma treatment. And the peel strength between PI film and copper foil enhanced. |
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