李雅丽,付新,党蕊.乙二醇介质中铜微粉表面化学镀银的研究[J].表面技术,2012,(3):60-62.
LI Ya-li,FU Xin,DANG Rui.Study on the Eletcroless Silver Plating on Copper Powders in Ethylene Glycol Medium[J].Surface Technology,2012,(3):60-62 |
| 乙二醇介质中铜微粉表面化学镀银的研究 |
| Study on the Eletcroless Silver Plating on Copper Powders in Ethylene Glycol Medium |
| 投稿时间：2012-01-10 修订日期：2012-06-20 |
| DOI： |
| 中文关键词: 乙二醇 化学镀银 银包铜粉 导电浆料 |
| 英文关键词:ethylene glycol eletcroless plating silver silver-coated copper powder electronic paste |
| 基金项目:陕西省自然科学基金(2011JM6005) |
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| 中文摘要: |
| 在新生成的铜微粉表面化学镀银,用扫描电镜、X射线衍射仪、动态光散射粒径测试仪和热重仪对粉体进行表征和性能测试,分析了粉体导电性、抗氧化性及粒径大小和分布的影响因素。结果表明:在乙二醇介质中采用液相还原法,通过葡萄糖预还原,用甲醛进行二次还原,控制银与铜物质的量之比为2:1,可得到抗氧化性、导电性良好的银包铜微粉。 |
| 英文摘要: |
| The surface of copper powers was plated with silver. The silver-coated copper power was characterized and its performances were tested by XRD,DLS and TG.The influence factors of conductivity, antioxidativity and its particle size were analyzed. The results show that silver-coated copper powders are prepared by liquid chemical reduction methed, which glucose as prereductant and formaldehyde as reductant in ethylene glycol system. The mole ratio of copper and silver is 2:1. Silver-coated copper powders exhibit excellent conductivity and antioxidativity. |
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