郑晓峰,曾其勇,李柱,吴凯,朱明.NiCr-NiSi传感器薄膜附着力测试与分析[J].表面技术,2012,(2):109-112.
ZHENG Xiao-feng,ZENG Qi-yong,LI Zhu,WU Kai,ZHU Ming.The Testing and Analysis for Adhesion of Thin-film of NiCr/NiSi Sensor[J].Surface Technology,2012,(2):109-112
NiCr-NiSi传感器薄膜附着力测试与分析
The Testing and Analysis for Adhesion of Thin-film of NiCr/NiSi Sensor
投稿时间:2011-12-02  修订日期:2012-04-20
DOI:
中文关键词:  薄膜热电偶  正交试验  极差分析  薄膜附着力
英文关键词:thin-film thermocouple  orthogonal experiment  range analysis  thin-film adhesion
基金项目:国家自然科学基金(50775210);国家公益性行业科研专项(2007GYJ016)
作者单位
郑晓峰 浙江机电职业技术学院机械工程学院,杭州310053 
曾其勇 中国计量学院质量与安全工程学院,杭州310018 
李柱 浙江机电职业技术学院机械工程学院,杭州310053 
吴凯 中国计量学院质量与安全工程学院,杭州310018 
朱明 中国计量学院质量与安全工程学院,杭州310018 
AuthorInstitution
ZHENG Xiao-feng Mechanical Engineering School, Zhejiang Electromechanical Vocational Technical College, Hangzhou 310053, China 
ZENG Qi-yong School of Quality & Safety Engineering, China Jiliang University, Hangzhou 310018, China 
LI Zhu Mechanical Engineering School, Zhejiang Electromechanical Vocational Technical College, Hangzhou 310053, China 
WU Kai School of Quality & Safety Engineering, China Jiliang University, Hangzhou 310018, China 
ZHU Ming School of Quality & Safety Engineering, China Jiliang University, Hangzhou 310018, China 
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中文摘要:
      采用磁控溅射法制备NiCr-NiSi薄膜,以溅射功率、溅射时间、溅射气压及基片负偏压作为四因素进行正交试验,制备了9种性能不同的NiCr-NiSi薄膜热电偶测温刀头,对每片测温刀头上薄膜与刀体之间的附着力进行了测试,并对测试结果进行了极差分析。分析结果表明:在4个溅射因素当中,基片负偏压是影响薄膜附着力大小的最主要因素,在一定范围内,增大基片的负偏压值可提高薄膜的附着力。验证试验表明,NiCr薄膜溅射参数为溅射功率90W、溅射时间30min、溅射气压0.45Pa、基片偏压-110V,NiSi薄膜溅射参数为溅射功率100W、溅射时间40min、溅射气压0.4Pa、基片偏压-110V,可使NiCr和NiSi薄膜的附着力值分别约增大3.2N 和1.5N。
英文摘要:
      By the method of orthogonal experiment, 9 NiCr-NiSi thin-film thermocouples with different properties were prepared on the rake face of different cutting tools, and orthogonal test was conducted with four factors sputtering power, sputtering time, sputtering pressure and substrate negative bias. The adhesion between the thin-film and the cutting tool were tested, and the results was analyzed by range analysis. It show that, among the four sputtering factors, substrate bias is the most important factor which influences thin-film adhesion. In a certain range, increasing the substrate negative bias voltage can enhance the thin-film adhesion. Subsequently, the range analysis result was verified by test. The experiment indicates that NiCr thin-film sputtering parameters are selected as sputtering power(90 W), sputtering time(30 min), sputtering pressure(0.45Pa), substrate bias(-110V). NiSi thin-film sputtering parameters are selected as sputtering power(100 W), sputtering time(40 min), sputtering pressure(0.4 Pa), substrate bias(-110V). As a result, the adhesion of NiCr and NiSi film increases 3.2 N and 1.5 N around individually.
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