滕培秀,魏喆良,赵伟.乙醇体系中铜基材浸镀银的动力学研究[J].表面技术,2012,(2):38-42.
TENG Pei-xiu,WEI Zhe-liang,ZHAO Wei.Kinetics of Immersion Silver Plating onto Copper Substrate in Ethanol-based Solution System[J].Surface Technology,2012,(2):38-42
乙醇体系中铜基材浸镀银的动力学研究
Kinetics of Immersion Silver Plating onto Copper Substrate in Ethanol-based Solution System
投稿时间:2011-11-28  修订日期:2012-04-20
DOI:
中文关键词:  动力学  紫铜  浸镀银  乙醇  沉积速率
英文关键词:kinetics  red copper  immersion silver  ethanol  deposition rate
基金项目:福州大学科技发展基金资助项目(2011灢XQ灢013)
作者单位
滕培秀 福州大学机械工程及自动化学院,福州350108 
魏喆良 福州大学机械工程及自动化学院,福州350108 
赵伟 福州大学机械工程及自动化学院,福州350108 
AuthorInstitution
TENG Pei-xiu College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China 
WEI Zhe-liang College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China 
ZHAO Wei College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China 
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中文摘要:
      以硝酸银为主盐,乙二胺为络合剂,乙醇为溶剂,在紫铜表面镀银。研究了浸镀银平均沉积速率随时间的变化规律,并对沉积速率与银离子浓度、乙二胺加入量、镀液温度、镀液pH 值和乙醇加入量等工艺参数的关系曲线进行线性拟合,得到了各反应级数和表观活化能。最后得出动力学沉积速率方程,并进行了验证。
英文摘要:
      Silver planting on the surface of red copper was obtained by using silver nitrate as main salt, ethylene-diamine as complexant and ethanol as solvent. Variation of mean deposition rate for immersion silver along with plating time was investigated. Each reaction order and the apparent activation energy were obtained by linear-fitting of the relation curve between deposition rate and silver ion concentration, amount of ethylenediamine, temperature of the solution, the pH value and amount of ethanol. Kinetics equations of deposition rate were got and be verified.
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