刘光明,刘德强,汪元奎,任永峰,邱佳红,田继红.T91钢表面复合电沉积Ni/CrAl镀层的工艺研究[J].表面技术,2012,(1):61-63.
LIU Guang-ming,LIU De-qiang,WANG Yuan-kui,REN Yong-feng,QIU Jia-hong,TIAN Ji-hong.Preparation of Ni/CrAl Coatings on T91 Steel by Composite Electrodeposition[J].Surface Technology,2012,(1):61-63
T91钢表面复合电沉积Ni/CrAl镀层的工艺研究
Preparation of Ni/CrAl Coatings on T91 Steel by Composite Electrodeposition
投稿时间:2011-11-04  修订日期:2012-02-20
DOI:
中文关键词:  复合电沉积  Ni/CrAl  镀层
英文关键词:composite electrodeposition  Ni/CrAl  coating
基金项目:国家自然科学基金(51161022)
作者单位
刘光明 南昌航空大学材料科学与工程学院,南昌330063 
刘德强 南昌航空大学材料科学与工程学院,南昌330063 
汪元奎 东方锅炉集团有限公司材料研究所,自贡643001 
任永峰 宝鸡石油钢管有限责任公司钢管研究院,宝鸡721008 
邱佳红 东方锅炉集团有限公司材料研究所,自贡643001 
田继红 南昌航空大学材料科学与工程学院,南昌330063 
AuthorInstitution
LIU Guang-ming School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
LIU De-qiang School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
WANG Yuan-kui Material Research Institute,Dongfang Boiler GroupCo.,Ltd.,Zigong 643001, China 
REN Yong-feng Steel Pipe Research Institute,Baoji Petroleum Steel PipeCo.,Ltd.,Baoji 721008, China 
QIU Jia-hong Material Research Institute,Dongfang Boiler GroupCo.,Ltd.,Zigong 643001, China 
TIAN Ji-hong School of Materials Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
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中文摘要:
      采用复合电沉积法在T91钢表面制备Ni/CrAl镀层,研究了CrAl微粒在镀层中的含量与搅拌强度、镀液pH 值、电流密度及温度的关系,确定最佳工艺参数为:电流密度2.5~4.5A/dm2,pH 值4~4.5,温度30℃。采用该工艺制备了较高CrAl含量的复合镀层,并对工艺参数影响复合电沉积的机理进行了简单探讨。
英文摘要:
      Ni/CrAl coating was prepared on T91 steel by composite electrodeposition process. The relationship between CrAl content in coating and stirring intensity, currnt density, pH as well as temperatures were studied in Watts solution. The optimum process of composite electrodeposition of Ni/CrAl composite coating was obtained as follows: current density was 2.5~4.5 A/dm2, the temperature was held at 30℃ and pH was 4~4.5. According to this electrodeposition process high content CrAl coating was obtained. The mechanism of electrodepostion affected by process parameter was discussed in brief.
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