胡睿,魏洪源,熊晓玲,张华明,王关全,杨玉青.利用偶联技术制备核电池用镍膜的工艺初探[J].表面技术,2010,39(4):62-64.
HU Rui,WEI Hong-yuan,XIONG Xiao-ling,ZHANG Hua-ming,WANG Guan-quan,YANG Yu-qing.Pilot Studies on Preparation of Nickel Films Used in Nuclear Batteries Based on Coupling Technology[J].Surface Technology,2010,39(4):62-64
利用偶联技术制备核电池用镍膜的工艺初探
Pilot Studies on Preparation of Nickel Films Used in Nuclear Batteries Based on Coupling Technology
投稿时间:2010-04-20  修订日期:2010-08-10
DOI:
中文关键词:  核电池    加载
英文关键词:nuclear batteries  nickel  incorporation
基金项目:中国工程物理研究院科学技术发展基金资助项目(2007A02001)
作者单位
胡睿 中国工程物理研究院核物理与化学研究所,绵阳621900 
魏洪源 中国工程物理研究院核物理与化学研究所,绵阳621900 
熊晓玲 中国工程物理研究院核物理与化学研究所,绵阳621900 
张华明 中国工程物理研究院核物理与化学研究所,绵阳621900 
王关全 中国工程物理研究院核物理与化学研究所,绵阳621900 
杨玉青 中国工程物理研究院核物理与化学研究所,绵阳621900 
AuthorInstitution
HU Rui Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
WEI Hong-yuan Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
XIONG Xiao-ling Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
ZHANG Hua-ming Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
WANG Guan-quan Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
YANG Yu-qing Institute of Nuclear and Chemistry, China Academy of Engineering Physics, Mianyang 621900, China 
摘要点击次数:
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中文摘要:
      曲面换能单元的核电池中镍-63的加载难以用常规源片加载法实现。采用偶联技术,对功能高分子膜的表面用偶联剂改性后进行活化处理,初步制备了镀有非放镍的高分子薄膜,并分析了此工艺的反应机理。采用该工艺可避免常规化学镀镍方法中试剂对半导体材料的损伤。
英文摘要:
      It is difficult to achieve the incorporation of nickel-63 onto the non-planar transducer unit in nuclear batteries with conventional sheet radioisotope sources. By coupling technique, the surface of functional polymer membrane was modified with coupling agents and activated. The polymer film plated with stable nickel was prepared initially. And the reaction mechanism of this process was analyzed. This kind of process made the semiconductor material avoid the damages which brought by some chemical reagents in the conventional method of electroless nickel plating.
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