贾晓凤,杜朝军.以DMDMH和MET为配位剂的无氰镀银工艺研究[J].表面技术,2010,39(4):59-61,72.
JIA Xiao-feng,DU Chao-jun.Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents[J].Surface Technology,2010,39(4):59-61,72
以DMDMH和MET为配位剂的无氰镀银工艺研究
Study on Cyanide-free Silver Electroplating Process with DMDMH and MET as Coordination Agents
投稿时间:2010-04-19  修订日期:2010-08-10
DOI:
中文关键词:  DMDMH  蛋氨酸  无氰镀银  配位剂
英文关键词:DMDMH  Met  cyanide-free silver electroplating  coordination agent
基金项目:河南省教育厅2010年度自然科学研究计划项目(2010C150003)
作者单位
贾晓凤 南阳理工学院生物与化学工程学院,南阳473004 
杜朝军 南阳理工学院生物与化学工程学院,南阳473004 
AuthorInstitution
JIA Xiao-feng School of Biology and Chemical Engineering, Nanyang Institute of Technology, Nanyang 473004, China 
DU Chao-jun School of Biology and Chemical Engineering, Nanyang Institute of Technology, Nanyang 473004, China 
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中文摘要:
      研究了以Met和DMDMH为配位剂的无氰镀银工艺,通过探讨镀液组成及工艺条件对镀层外观质量的影响,确定了最佳电镀工艺。测试了镀液的阴极电流效率、分散能力、覆盖能力,以及银镀层的微观形貌和结合强度等。测试结果表明,该无氰镀银工艺基本达到了氰化物镀银工艺的相关指标,有望成为氰化物镀银的替代工艺。
英文摘要:
      A cyanide-free silver electroplating process with Met and DMDMHas coordination agents was studied. The influences of bath composition and operation conditions of the process on the appearance of silver coatings were investigated, and on this basis the optimal electroplating process was defined.It has been found by examinations of cathode current efficiency, throwing power, covering power of the bath and adhesion of the silver films that this process is the same as and even better in some aspects than cyanide process, and worth popularization in industrial applications.
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