姚怀,苌清华,王喜然,陈艳芳.溶液温度对铝合金化学镀Ni-W-P三元合金的影响[J].表面技术,2010,39(2):61-63.
YAO Huai,CHANG Qing-hua,WANG Xi-ran,CHEN Yan-fang.The Effect of Temperature on the Electroless Ni-W-P Ternary Alloys Plating on the Aluminum Alloy[J].Surface Technology,2010,39(2):61-63 |
| 溶液温度对铝合金化学镀Ni-W-P三元合金的影响 |
| The Effect of Temperature on the Electroless Ni-W-P Ternary Alloys Plating on the Aluminum Alloy |
| 投稿时间：2009-11-19 修订日期：2010-04-10 |
| DOI： |
| 中文关键词: 化学镀 镍钨磷合金 硬度 镀速 |
| 英文关键词:Chemistry plates Ni-W-P alloy Hardness Deposition rate |
| 基金项目: |
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| Author | Institution |
| YAO Huai | 1.Henan University of Science and Technology, Luoyang 471003, China;2.Henan Key Laboratory of Non- ferrous Metal Materials Science and Processing, Luoyang 471003, China |
| CHANG Qing-hua | Henan University of Science and Technology, Luoyang 471003, China |
| WANG Xi-ran | Henan University of Science and Technology, Luoyang 471003, China |
| CHEN Yan-fang | Henan University of Science and Technology, Luoyang 471003, China |
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| 中文摘要: |
| 在化学镀中镀液的温度不仅影响施镀过程的沉积速度,而且还将直接影响镀层成分及镀层性能。通过X射线衍射(XRD)、扫描电(SEM)等测试手段着重研究了溶液温度对化学镀Ni-W-P镀层微观组织、相组成、镀速及硬度的影响。结果表明:温度为85℃时,镀层已完全覆盖基体,表面由胞状颗粒组成,大小比较均匀,颗粒直径平均为7μm左右,无明显的缺陷,W的含量高达9.60%,镀态下的硬度高达HV 610左右,镀速为11μm/h。 |
| 英文摘要: |
| In the chemical plating, the temperature of plating bathin the plating process not only affects the deposition but also has a directimpact on the component and performance of plating. The effect of temperature of plating bath on microstructure, phase composition, depositing velocity and hardness of electroless Ni-W-P plating were changed by XRD、SEM、DTA and so on. The results show that the substrate is covered of Ni-W-P plating completely, the surface is composed of uniform crystalline grains, the contents of Wis about 9.60% and no obvious defects, the diameter of grains is about 7μm, the hardness is reach to HV 610and deposition rate is 11μm/h. |
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