王姗姗,祝要民,任凤章,殷立涛.电镀工艺对镍纳米膜微观结构及硬度的影响[J].表面技术,2010,39(2):52-54.
WANG Shan-shan,ZHU Yao-min,REN Feng-zhang,YIN Li-tao.Effect of Plating Process on the Microstructure and Hardness of Ni Nano-films[J].Surface Technology,2010,39(2):52-54 |
| 电镀工艺对镍纳米膜微观结构及硬度的影响 |
| Effect of Plating Process on the Microstructure and Hardness of Ni Nano-films |
| 修订日期：2010-04-10 |
| DOI： |
| 中文关键词: 纳米晶Ni膜 添加剂 硬度 微观形貌 织构 |
| 英文关键词:nanocrystalline Ni film additive hardness microstructure texture |
| 基金项目:国家自然科学基金项目(50771042);河南省基础与前沿技术研究计划(092300410064);河南省高校科技创新人才支持计划项目(2009HASTIT023) |
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| Author | Institution |
| WANG Shan-shan | Henan University of Science and Technology, Luoyang 471003, China |
| ZHU Yao-min | Henan University of Science and Technology, Luoyang 471003, China |
| REN Feng-zhang | 1.Henan University of Science and Technology, Luoyang 471003, China;2.Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang 471003, China |
| YIN Li-tao | Henan University of Science and Technology, Luoyang 471003, China |
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| 中文摘要: |
| 采用直流电沉积法制备纳米晶镍膜,研究了添加剂C12H24NaSO4,TJ,GL-100对镀层微观表面形貌、硬度、晶粒尺寸及织构的影响,同时探讨了电流密度对硬度的影响。结果表明:在无添加剂和仅加入C12H24NaSO4时,改变了镀层晶面的生长速率和晶粒快速的生长方向,使(200)晶面发生织构;TJ的添加显著细化晶粒;TJ和GL-100复合添加使镀层晶粒在(111)晶面择优取向生长。3种添加剂的复合作用,使镀层表面形貌及硬度达到最佳状态。在电镀条件相同时,镀层的硬度随电流密度的增加而增加。 |
| 英文摘要: |
| Ni nano-films were obtained by direct current electrodeposition. The effect of C12H24NaSO4, TJ and GL-100 on coating of micro-surface morphology, hardness, grain size and texture, and the relation of between current density and hardness were studied. The results indicate that the growth rate and direction of the crystal surface are changed, and the crystal plane(200)is occurred texture when the electro-bath is absence of additives or only join C12H24 NaSO4.The addition of TJ make the grain significant refainment. The coating grains prefer to grow with orientation in the crystal plane(111)when TJ and GL-100 are added in the electro-bath.Surface morphology and hardness of the coating achieve the best condition with adding three kinds of additives. On the same plating conditions, the coating hardness increases with the increasement of current density. |
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