张勇,安振涛,闫军,谢俊磊.低温、高速、高稳定性化学镀镍研究进展[J].表面技术,2008,37(6):81-83.
ZHANG Yong,AN Zheng-tao,YAN Jun,XIE Jun-lei.The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating[J].Surface Technology,2008,37(6):81-83 |
| 低温、高速、高稳定性化学镀镍研究进展 |
| The Progress of Study on Low-temperature, High-speed and High Stability Chenucal Plating |
| 投稿时间：2008-07-21 修订日期：2008-12-10 |
| DOI： |
| 中文关键词: 化学镀镍 非晶态合金 低温 高速 镀液稳定性 电磁屏蔽 |
| 英文关键词:Chemical plating nickel Amorphous alloy Low-temperature High-speed Plating solution stability Electromagnetic shield |
| 基金项目: |
|
|
|
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| Ni-P非晶态合金镀层作为一种功能镀层，具有优良的电磁屏蔽、静电防护性能以及优良的物理化学性能。以往研究较多的是在酸性镀液中进行的化学镀沉积Ni-P非晶态合金镀层，温度一般较高，使化学镀的应用受到了限制，尤其是对塑料等非金属材料的表面金属化。因此，低温、高速化学镀越来越受到科研工作者的重视。同时，镀液的稳定性是化学镀能否顺利施镀以及降低化学镀成本的重要因素。鉴于此，在对国内外低温、高沉积速度化学镀镍及镀液稳定性方面的研究进行总结的基础上，展望了化学镀镍研究领域的发展方向。 |
| 英文摘要: |
| Ni-P amorphous alloy cladding possesses the fine electromagnetism and static electricity protective performance as a kind of function cladding material, as well as the fine physical chemistry function. Currently, many study adopts the acidic plating solution, the temperature is upper, so the application of chemical plating is limited, especially chemical plating on the surface of plastic. So, chemical plating under the condition of low temperature and high speed is regarded by investigator; simultaneously, the stability of plating solution is important factor that whether chemical plating can successful or not, and reduce the cost of chemical plating. The research of chemical plating nickel in low temperature and high speed and plating solution stability was summarized, and the development direction of chemical plating nickel was viewed |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号