洪逸,张晓燕,李广宇,马小东,敖启艳.Cu-W复合电沉积工艺研究[J].表面技术,2008,37(5):64-65,84.
HONG Yi,ZHANG Xiao-yan,LI Guang-yu,MA Xiao-dong,AO Qi-yan.Study on Cu-W Composite Electroplating Process[J].Surface Technology,2008,37(5):64-65,84
Cu-W复合电沉积工艺研究
Study on Cu-W Composite Electroplating Process
投稿时间:2008-07-07  修订日期:2008-10-10
DOI:
中文关键词:  复合电沉积  复合镀层  工艺参数  电接触材料  铜钨合金
英文关键词:Composite electrodeposition  Composite deposits  Process parameter  Electrical contact material  Cu-W alloy
基金项目:贵州大学大学生创新性实验计划项目( 2007 -004)
作者单位
洪逸 贵州大学材料科学与冶金工程学院,贵州贵阳550003 
张晓燕 1.贵州大学材料科学与冶金工程学院,贵州贵阳550003;2.贵州省材料结构与强度重点实验室,贵州贵阳550003 
李广宇 贵州大学材料科学与冶金工程学院,贵州贵阳550003 
马小东 贵州大学材料科学与冶金工程学院,贵州贵阳550003 
敖启艳 贵州大学材料科学与冶金工程学院,贵州贵阳550003 
AuthorInstitution
HONG Yi School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China 
ZHANG Xiao-yan 1. School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China;2. Guizhou Key Laboratory for Mechanical Behavior and Microstructure of Materials, Guizhou University, Guiyang 550003, China 
LI Guang-yu School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China 
MA Xiao-dong School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China 
AO Qi-yan School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China 
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中文摘要:
      电接触材料要求具有很好的抗电弧烧蚀和抗熔焊性能,但纯铜很难达到该种要求。利用复合电沉积方法,在纯铜表面形成Cu-W复合镀层,使其满足电触头材料的使用性能。重点研究了镀液中W的质量浓度、电流密度、搅拌强度和温度工艺参数对Cu-W电接触材料复合镀层中W微粒沉积量的影响,并且通过正交试验确定了复合电沉积的最优工艺:W的质量浓度为35g/L、电流密度为4A/dm2、搅拌强度为600r/min、温度为50℃。
英文摘要:
      Contact materials are demanded to have finer electric erosion resistance and anti-welding properties, but pure copper cant meet the requirement easily. The Cu-W composite deposits was formed on the surface of pure copper by composite electro deposition, to meet the service performance of contact material. The influence of W particulate content in Cu-W composite deposits including W mass concentration, current density, stimng intention and temperature on W particulate content in Cu-W composite deposits was laid special stress on, and the optimum process parameters for composite electrodeposition were determined by orthogonal experimentations. And the optimal process: W mass concentration 35 g/L, current density 4A/dm2 , stimng intention 600 r/min, the temperature of 500℃.
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