胡立新,占稳,寇志敏,武瑞黄,欧阳贵.PCB 上化学镀银的研究[J].表面技术,2008,37(5):45-48.
HU Li-xin,ZHAN Wen,KOU Zhi-min,WU Rui-huang,OU Yang-gui.Study on Electroless Silver Plating on PCB[J].Surface Technology,2008,37(5):45-48 |
| PCB 上化学镀银的研究 |
| Study on Electroless Silver Plating on PCB |
| 投稿时间：2008-06-23 修订日期：2008-10-10 |
| DOI： |
| 中文关键词: 印制电路板 化学镀银 甲基磺酸 原子力显微镜 质量检验 |
| 英文关键词:PCB Electroless silver plating Methane Suhonic acid Atomic force microscopy Quality testing |
| 基金项目: |
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| Author | Institution |
| HU Li-xin | School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan 430068 , China |
| ZHAN Wen | School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan 430068 , China |
| KOU Zhi-min | School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan 430068 , China |
| WU Rui-huang | School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan 430068 , China |
| OU Yang-gui | Wuhan Research Institute of Materials Protection, Wuhan 430030, China |
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| 中文摘要: |
| 选择甲基磺酸作为化学镀银的酸性体系，考察了主盐、各种添加剂和相关工艺条件对镀层厚度及其质量的影响。结果表明在AgN03浓度为2.5g/L，甲基磺酸的质量分数占12%，反应时间为5min等条件下，所得到的镀层均匀银白光亮，厚度为0.16μm。该工艺适用于印制电路板( PCB)上的焊接处理。并利用原子力显微镜对镀层表面形貌的检测考察了影响镀层质量的某些因素。 |
| 英文摘要: |
| It's researched that methane sulfonic acid was used to be a acid system at electroless silver plating. Main salt, some additives and correlative technics which could affect the thickness and quality of plating surface were investigated. The result shows that the plating surface obtainted at AgN03 2. 5g/L, methane sulfonic acid 12% ( wt) , reaction time Smin and so on, of which the thickness was up t0 0.16μm, is symmetrical and silvery white. The process can apply at weld which is a procedure on PCB. Furthermore, some factors which may affect the quality of plating surface were discusseed by characterizing of surface appearance with atomic force rmcroscopy ( AFM) . |
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