吴化波,王志法,刘金文,崔大田,姜国圣,周俊.钨铜材料电镀镍层常见缺陷分析及解决方法[J].表面技术,2008,37(3):80-83.
WU Hua-bo,WANG Zhi-fa,LIU Jin-wen,CUI Da-tia,JIANG Guo-sheng,ZHOU Jun.Analysis and Treatment of Nickel-plating Layer Defects on the W/Cu Composites[J].Surface Technology,2008,37(3):80-83 |
| 钨铜材料电镀镍层常见缺陷分析及解决方法 |
| Analysis and Treatment of Nickel-plating Layer Defects on the W/Cu Composites |
| 投稿时间：2008-01-10 修订日期：2008-06-10 |
| DOI： |
| 中文关键词: 钨铜复合材料 缺陷分析 孔洞 油污 鼓泡 腐蚀 |
| 英文关键词:W/Cu composites Defect analysis Hole Stain, Bubbling Erosion |
| 基金项目:国家高新工程重点项目( 02 -2002 -021) |
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| Author | Institution |
| WU Hua-bo | Material College of Central South University, Changsha 410083 , China |
| WANG Zhi-fa | Material College of Central South University, Changsha 410083 , China |
| LIU Jin-wen | Material College of Central South University, Changsha 410083 , China |
| CUI Da-tia | Material College of Central South University, Changsha 410083 , China |
| JIANG Guo-sheng | Material College of Central South University, Changsha 410083 , China |
| ZHOU Jun | Material College of Central South University, Changsha 410083 , China |
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| 中文摘要: |
| 就钨铜材料表面电镀镍层常见的孔洞、油污、鼓泡和腐蚀等缺陷进行了研究；采用扫描电镜和金相显微镜对缺陷形貌进了观察，并通过能谱分析对缺陷处元素组成进行了研究。研究结果表明：电镀层的孔洞是由于钨铜基材中存在较大孔洞造成的；油污是由于基材表面的针孔里残留有电镀液而引起的；鼓泡是由于钨铜基材表面存在氧化铝；腐蚀是因为电镀工艺不恰当引起的。还对不同缺陷提出了相应的解决方法。 |
| 英文摘要: |
| The common defects of nickel-plating layer on the W/Cu composites were studied, including hole, stain, bubbling and erosion. The morphologies of those defects were mvestigated by SEM and Metallograph; the elements in those defects were determined by EDS. The results indicate that holes in nickel-plating layer are due to the big holes in the matrix of W/Cu composites, electroplating bath left in the pinhole of the surface of W/Cu composites is the major reason for the stain, bubbling is induced by the Al203 in the surface of the matrix, and the erosion is due to the inappropriate electroplating process. The relative technical treatment for the different defects was also given. |
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