董坤,李德良,吴赣红.无铅化学镀镍稳定剂研究[J].表面技术,2008,37(3):12-13,29.
DONG Kun,LI De-Iiang,WU Gan-hong.Study on Lead-free Stabilizer for Electroless Nickel Plating[J].Surface Technology,2008,37(3):12-13,29 |
| 无铅化学镀镍稳定剂研究 |
| Study on Lead-free Stabilizer for Electroless Nickel Plating |
| 投稿时间：2008-03-07 修订日期：2008-06-10 |
| DOI： |
| 中文关键词: 化学镀镍 无铅化 稳定剂 沉积速度 |
| 英文关键词:Electroless nickel plating Lead-free Stabilizer Depositing velocity |
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| 中文摘要: |
| 为了研究出一种优良的无铅化学镀镍稳定剂，以传统的化学镀镍基础配方为前提，选择Na2 S2 03 .Sl（一种含硫有机物）、CuSO4和苯并三氮唑作为稳定剂，比较了其对镀液的稳定性能、镀速和镀层性能等影响。结果表明：Sl作为化学镀镍液的稳定剂，不仅能使镀液稳定性能良好，而且镀层性能优异。 |
| 英文摘要: |
| In order to study the lead-free stabilizer for electroless nickel plating, four stabilizers of Na2S203 , S1 , CuS04 and benzotriazole were added respectively, and the stabilizing effects of these four stabilizers on electroless nickel bath were investigated. It is found that Sl is an excellent electroless nickel bath stabilizer which can not only stabilize the bath very well but also bring an excellent corrosion resistance. |
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