杨煜,高玲,福本昌宏,李雪峰.粒子扁平现象研究现状及发展[J].表面技术,2008,37(2):67-70.
YANG Kun,GAO Ling,Fukumoto Masahiro,LI Xue-feng.Research Present and Development of Flattening Behavior[J].Surface Technology,2008,37(2):67-70
粒子扁平现象研究现状及发展
Research Present and Development of Flattening Behavior
投稿时间:2007-10-18  修订日期:2008-04-10
DOI:
中文关键词:  等离子喷涂  扁平行为  溅射  盘状沉积
英文关键词:Plasma spray  Flattening behavior  Sputtering  Disk deposition
基金项目:
作者单位
杨煜 日本璺橘技衍科学大学接合加工研究室,日本璺橘441-8580 
高玲 西北有色金属研究院超导材料研究所,陕西西安710016 
福本昌宏 日本璺橘技衍科学大学接合加工研究室,日本璺橘441-8580 
李雪峰 莱芜钢铁集团有限公司技术研发中心(棒材研究所),山东莱芜271104 
AuthorInstitution
YANG Kun Toyohashi University of Technology, Toyohashi 441-8580, Japan 
GAO Ling Northwest Institute for Nonferrous Metal Research, Xi' an 710016, China 
Fukumoto Masahiro Toyohashi University of Technology, Toyohashi 441-8580, Japan 
LI Xue-feng R&D Center of Laiwu Steel Group, Laiwu 271104, China 
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中文摘要:
      热喷涂过程中熔滴在与基材撞击后的扁平及固化行为是形成涂层过程中的一个基本现象,因此,关于单个粒子扁平化行为的研究不可或缺。从等离子喷涂过程中基材预热温度、喷涂压强环境、材料润湿能力、基材的表面粗糙度、固化能力、脱附吸附能力等因素对粒子扁平化转变的影响,以及研究过程中自由下落试验和数值模拟方法的应用,概述了关于粒子扁平现象的研究现状。指出了未来关于粒子扁平化研究的发展趋势在于结合数值模拟和喷涂试验,以期找出粒子扁平化的控制因素。并解释了基材在较高的预热温度和低压条件下,盘状沉积为何更容易出现。
英文摘要:
      As the flattening and solidification behavior of the thermal sprayed particle impinged onto the flat substrate surface can be recognized as a fundamental phenomenon of the coating formation of the plasma spray process, a clarification of the flattening behavior of an individual particle is essential. In order to discuss the present status and development of flattening behavior research, the factors such as pre-heating temperature, spray ambient pressure, wetting ability, roughness of the substrate, solidification, desorption of adsorbates, which influenced the flattening behavior during the plasma spray process were introduced, and also the use of free falling experiment and numerical simulation method during the research work. Then gave a forecast of the development of the flattening behavior research, the numerical simulation model and experiments would be widely used to find the dominate factors during the flatting behavior, and answer the question why and how the disk splat appears on hot substrate and low pressure condition.
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