魏喆良.乙二胺对铜基材浸镀银的影响[J].表面技术,2008,37(2):31-33.
WEI Zhe-liang.Effect of Ethylenediamine on Immersion Silver Plating on Copper Substrate[J].Surface Technology,2008,37(2):31-33 |
| 乙二胺对铜基材浸镀银的影响 |
| Effect of Ethylenediamine on Immersion Silver Plating on Copper Substrate |
| 投稿时间：2007-10-10 修订日期：2008-04-10 |
| DOI： |
| 中文关键词: 浸镀银 络合剂 乙二胺 置换反应 |
| 英文关键词:Immersion silver Ligand Ethylenediamine Displacement |
| 基金项目:福建省纳米研究专项资助项目( 2005 HZOI_2-7) |
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| 中文摘要: |
| 为了克服铜基材在简单银盐溶液中浸镀银时易产生浮银层的问题，利用容量滴定法、电化学方法和扫描电子显微分析等手段，研究了添加络合剂乙二胺对铜基材浸镀银沉积速度、沉积过程以及镀层形貌的影响。结果表明：添加络合剂乙二胺后，不仅使银在铜基材表面的沉积速度减小，还使吸附的银原子沿铜基材表面生长，从而获得均匀致密的银镀层。 |
| 英文摘要: |
| To avoid getting loose immersion silver plating on copper substrate in simple silver salt solution, the effects of ethylenediamine on silver deposition rate, deposition process and finishing appearance were studied by capacity titration, electrochemical method and FE-SEM. The results show that as a ligand, ethylenediamine not only can slow down the silver deposition rate, but also make the adhered silver atoms grow up along the surface of copper substrate, and so a smooth and dense silver coating is obtained. |
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