乔永莲,许茜,刘会军,孟巍伟,李成财,翟玉春.导电塑料表面电化学镀镍和镀层表征[J].表面技术,2008,37(2):1-3,7.
QIAO Yong-lian,XU Qian,LIU Hui-jun,MENG Wei-wei,LI Cheng-cai,ZHAI Yu-chun.Preparation and Characterization of Nickel Coating on Conductive Plastic by Electrodeposition[J].Surface Technology,2008,37(2):1-3,7
导电塑料表面电化学镀镍和镀层表征
Preparation and Characterization of Nickel Coating on Conductive Plastic by Electrodeposition
投稿时间:2007-12-13  修订日期:2008-04-10
DOI:
中文关键词:  电镀  镀镍  导电塑料  腐蚀行为  NaCl水溶液
英文关键词:Electroplating  Nickel plating  Conductive plastic  Corrosion behavior  NaCl solution
基金项目:辽宁省自然科学基金资助项目(99106003)
作者单位
乔永莲 东北大学材料与冶金学院,辽宁沈阳110004 
许茜 东北大学材料与冶金学院,辽宁沈阳110004 
刘会军 东北大学材料与冶金学院,辽宁沈阳110004 
孟巍伟 东北大学材料与冶金学院,辽宁沈阳110004 
李成财 东北大学材料与冶金学院,辽宁沈阳110004 
翟玉春 东北大学材料与冶金学院,辽宁沈阳110004 
AuthorInstitution
QIAO Yong-lian School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
XU Qian School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
LIU Hui-jun School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
MENG Wei-wei School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
LI Cheng-cai School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
ZHAI Yu-chun School of Material and Metallurgy, Northeastern University, Shenyang 110004, China 
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中文摘要:
      为了提高导电塑料的表面硬度、强化表面导电行为,采用电沉积的方法在导电塑料上镀镍,研究了镀液温度、电镀时间和阴极电流密度对镀层厚度增长速度的影响,利用扫描电镜和金相显微镜对镀层进行了表征,采用粘结拉脱法测量了镀层与基体之间的结合力,采用电化学方法研究了镍镀层在NaCI水溶液中的腐蚀行为。结果表明:阴极电流密度为2.OA/dm2、镀液温度为60℃时,可以得到0.68 μm/min的平均镀层增长速率;镍镀层可以保留导电塑料基体的表面特征,镍镀层与基体之间结合力可以达到2. 3MPa以上;光亮镍镀层在NaCI水溶液中的腐蚀电位高于哑镍镀层的腐蚀电位,且在相同的极化电位下,光亮镍镀层阳极溶解速率也较低。
英文摘要:
      In order to enhance the surface hardness, electronic conductivity of conductive plastic , nickel coating was prepared on its surface by electroplating. The effects of bath temperature and coating time on nickel deposition rate were investigated, and the relationship between cathodic current density and the deposition rate was involved in as well. The surface morphology and cross-sectional microstructure of the Ni-coating were examined by scan electron microscope and optical microscope, respectively. The adhesion between the coating and substrate was evaluated by pull-off test, and corrosion behavior of the coating was studied by electrochemical methods. The results show that the average electrochemical nickel deposition rate is 0. 68 μm /min on the condition of cathodic current density of 2. OA/dm2 and bath temperature of 60℃ . The exoteric morphology of the coating can inherit some from the surface characteristic of the substrate, and the adhesion between of the coating and substrate is more than 2. 3MPa. The corrosion potential of the shining coating in NaCI aqueous solution is more positive than that of the dull coating, and anodic dissolving rate of the shining one is also far lower at the same polarization potential compared with the dull.
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