卞铁荣,卢正欣,井晓天.不同Cu含量的TiNiCu形状记忆合金薄膜的组织与相变[J].表面技术,2008,37(1):42-44.
BIAN Tie-rong,LU Zheng-xin,JING Xiao_tian.Microstructure and Phase Transformation of TiNiCu Shape Memory Alloy Films with Different Cu Content[J].Surface Technology,2008,37(1):42-44 |
| 不同Cu含量的TiNiCu形状记忆合金薄膜的组织与相变 |
| Microstructure and Phase Transformation of TiNiCu Shape Memory Alloy Films with Different Cu Content |
| 投稿时间：2007-10-23 修订日期：2008-02-10 |
| DOI： |
| 中文关键词: TiNiCu形状记忆合金 薄膜 相变 |
| 英文关键词:TiNiCu Shape memory alloy Films Phase transformation |
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| 中文摘要: |
| 利用TEM、XRD、DSC测试方法，首次系统地研究了直流磁控溅射制备的3种不同Cu含量的TiNiCu形状记忆合金薄膜的退火组织和加热与冷却过程中发生的相变。结果表明：退火后的薄膜获得了形状记忆性能；随着薄膜中Cu含量的增加，薄膜的退火组织出现差异，相变滞后明显变小，相变温区变窄；使获得快速响应的形状记忆合金薄膜成为可能。 |
| 英文摘要: |
| Using TEM, XRD and DSC method, annealed microstructure and transformation in heating and cooling of three TiNiCu shape memory alloy films with different Cu content by DC magnetron sputtering have been first studied systematically. The results show that annealed films gain shape memory; Annealed microstructure of annealed films takes on change, transformation hysteresis and transformation temperature range grow narrow obviously as Cu content of films rises. Its possible that gaining the film of responding fastly. |
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