靳佳琨.添加剂对甲基磺酸盐镀锡电沉积过程的影响[J].表面技术,2007,36(5):53-55.
JIN Jia-kun.Effect of Additive on the Process of Tin Electrodeposion in Methanesulfonate Solution[J].Surface Technology,2007,36(5):53-55 |
| 添加剂对甲基磺酸盐镀锡电沉积过程的影响 |
| Effect of Additive on the Process of Tin Electrodeposion in Methanesulfonate Solution |
| 投稿时间：2007-06-23 修订日期：2007-10-10 |
| DOI： |
| 中文关键词: 镀锡 电沉积.2 -巯基苯并噻唑 |
| 英文关键词:Tin plating Electrodeposition 2-mercaptobenzothiazole |
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| 中文摘要: |
| 为了探讨添加剂对锡电沉积的作用机理，运用循环伏安法、计时安培法和阴极极化曲线法研究了添加剂2一巯基苯并噻唑对锡电沉积过程的影响。结果表明锡的电沉积过程经历了晶核形成过程，其电结晶按照三维瞬时成核方式进行，加入添加剂没有改变锡的电结晶机理，对锡的电沉积过程起阻化作用，但有利于晶核的形成，从而可以得到结晶细致的镀层。 |
| 英文摘要: |
| In order to discuss the reaction mechanism of additive on tin electrodeposion, the effect of additive 2-mercaptobenzothiazole on the process of tin electrodeposition were studied using cyclic voltammetry, chronoamperometry and cathode polarization methods. The results indicat that tin crystal cell is formed by the mode of three-dimensional instantaneous nucleation. The mechanism of electrocrystallization is not changed after adding additive, and it produces an inhibition of the tin deposion , but the additive is good at the form of crystal cell, so the plating layer with fine morphology is obtained. |
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