张明明,张圣麟,孔小波.低温磷化现状及发展趋势[J].表面技术,2007,36(4):59-61.
ZHANG Ming-ming,ZHANG Sheng-lin,KONG Xiao-bo.Present Situation and Development Tendency of Low Temperature Phosphating[J].Surface Technology,2007,36(4):59-61
低温磷化现状及发展趋势
Present Situation and Development Tendency of Low Temperature Phosphating
投稿时间:2007-02-06  修订日期:2007-08-10
DOI:
中文关键词:  磷化  低温  加速剂  机理
英文关键词:Phosphating  Low temperature  Accelerant  Mechanism
基金项目:河南省科技攻关研究项目(0424240074);河南省自然科学研究项目(200510476009)
作者单位
张明明 河南师范大学化学与环境科学学院,河南新乡453007 
张圣麟 河南师范大学化学与环境科学学院,河南新乡453007 
孔小波 河南师范大学化学与环境科学学院,河南新乡453007 
AuthorInstitution
ZHANG Ming-ming Chemistry & Environmental Science College, Henan Normal University, Xinxiang 453007, China 
ZHANG Sheng-lin Chemistry & Environmental Science College, Henan Normal University, Xinxiang 453007, China 
KONG Xiao-bo Chemistry & Environmental Science College, Henan Normal University, Xinxiang 453007, China 
摘要点击次数:
全文下载次数:
中文摘要:
      低温磷化由于低能耗、低成本、低污染等特点,日益受到人们的关注。对低温磷化的特点、机理、促进剂、现状进行了研究,结果表明:目前主要采用电化学方法、化学方法、调整酸比和pH值等方法来降低磷化处理的温度,但低温磷化仍存在耐蚀性较差的缺点,难以满足大规模工业应用。由于磷化过程的复杂性,低温磷化的机理以及复合促进剂仍将是今后研究的重点。
英文摘要:
      Low temperature phosphating process has attracted much attention day by day because of its low energy consumption, low cost and low environmental pollution. The characteristics, mechanism, accelerants and present situation of low temperature phosphating process have been studied. It indicates that electro-chemical method, chemistry method, acidity and pH adjustment have been used in order to reduce the phosphating temperature, but low temperature phosphating still has the low corrosion resistance and can not suit for the large-scale industrial application. Because of the complexity of phosphating process, the study on the low temperature phosphating mechanism and compound accelerants will still be the key point.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第19501388位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号