张道军,邵红红,蒋小燕.A231镁合金化学镀工艺研究[J].表面技术,2007,36(4):54-56.
ZHANG Dao-jun,SHAO Hong-hong,JIANG Xiao-yan.Investigation of Electroless Plating on A231 Magnesium Alloys[J].Surface Technology,2007,36(4):54-56
A231镁合金化学镀工艺研究
Investigation of Electroless Plating on A231 Magnesium Alloys
投稿时间:2007-03-23  修订日期:2007-08-10
DOI:
中文关键词:  A231镁合金  Ni-P合金  化学镀  结合力
英文关键词:A231 Magnesium Alloys  Ni-P Alloys  Electroless plating  Adherence
基金项目:
作者单位
张道军 江苏大学材料科学与工程学院,江苏镇江212013 
邵红红 江苏大学材料科学与工程学院,江苏镇江212013 
蒋小燕 江苏大学材料科学与工程学院,江苏镇江212013 
AuthorInstitution
ZHANG Dao-jun School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China 
SHAO Hong-hong School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China 
JIANG Xiao-yan School of Materials Science and Engineering, Jiangsu University, Zhenjiang 212013, China 
摘要点击次数:
全文下载次数:
中文摘要:
      研究了在挤压态A231镁合金表面直接化学镀镍工艺。通过扫描电镜(SEM)和X射线衍射技术(XRD)对镀层组织结构及形貌和磷含量进行了检测分析,并对化学镀层表面进行了显微硬度和镀层与镁合金基体的结合力测试。结果表明:得到的Ni-P镀层均匀、致密、无明显缺陷,其平均沉积速度约为0.32 μm /min,平均显微硬度约为566HV,所含磷的质量分数为9.77%。前处理过程中的酸洗步骤使镁合金基体产生略为粗糙的表面,从而改善了镀层和基体之间机械咬合的作用,增加了镀层的结合力,结合力约为22N。
英文摘要:
      Direct electroless Ni-P plating on the A231 magnesium alloys in a plating bath containing nickel carbonate was investigated. The morphology and microstructure of the electroless Ni-P coating were studied by SEM and XRD. The electroless Ni-P coating was compact and no obvious defects. The hardness value of the Ni-P coatings was 566 HV and the phosphorus content of this coating was about 9. 77 wt% . The deposition rate of the electroless Ni-P alloys was about 0. 32μm/ h. The acid pickle pretreatment on the A231 magnesium alloy substrate provides surface pits to act as sites for mechanical interlocking to improve adhesion between the coating and the substrate. The adherence of them is 22No
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第19513474位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号