杜炳志,漆红兰.电化学抛光技术新进展[J].表面技术,2007,36(2):56-58.
DU Bing-zhi,QI Hong-Ian.Development of Electrochemical Polishing Technology[J].Surface Technology,2007,36(2):56-58 |
| 电化学抛光技术新进展 |
| Development of Electrochemical Polishing Technology |
| 投稿时间：2006-10-19 修订日期：2007-04-10 |
| DOI： |
| 中文关键词: 电化学 抛光 原理 进展 |
| 英文关键词:Electrochemistry Polishing Principle Development |
| 基金项目:国家自然科学基金(90607016) |
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| 中文摘要: |
| 随着材料加工不断地向精密化方向发展，传统抛光技术很难达到高精度的表面抛光要求。作为新型抛光技术一个很重要的分支，电化学抛光以其加工效率高、工件无损耗、表面光滑、无内应力、不受材料硬度的限制等优点，在表面抛光领域中得到快速的发展。简要介绍了电化学抛光的原理和特点，总结了影响电化学抛光效果的主要因素，综述了电化学抛光技术的新进展。 |
| 英文摘要: |
| With development of surface processing, the requirement of surface polishing for precision becomes higher and higher. Traditional technology of surface polishing can hardly satisfy the actual need for precision. Electrochemical polishing ( EP) technology has been quickly developed in the field of surface polishing. Compared with traditional polishing technology, the EP technology has some advantages : high efficiency, without damage and internal stresses~ lower roughness, hardness of materials unrestrained and so on. The principle and characteristics of EP technology were introduced and the effect of EP was presented. The new development of EP technology was extensively reviewed. |
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